Product Information

GS8321Z36AGD-250

GS8321Z36AGD-250 electronic component of GSI Technology

Datasheet
SRAM 2.5 or 3.3V 1M x 36 36M

Manufacturer: GSI Technology
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 50.0323 ea
Line Total: USD 50.03

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
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0 - WHS 1


Ships to you between Fri. 24 May to Tue. 28 May

MOQ : 1
Multiples : 1

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GS8321Z36AGD-250
GSI Technology

1 : USD 49.5882
10 : USD 44.9064
18 : USD 43.2781
54 : USD 41.9638
108 : USD 41.5335

     
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GS8321Z18/32/36AD-400/375/333/250/200/150 400 MHz150 MHz 165-Bump BGA 36Mb Pipelined and Flow Through 2.5 V, or 3.3 V V DD Commercial Temp Synchronous NBT SRAM 2.5 V, or 3.3 V I/O Industrial Temp Because it is a synchronous device, address, data inputs, and Features read/ write control inputs are captured on the rising edge of the User-configurable Pipeline and Flow Through mode input clock. Burst order control (LBO) must be tied to a power NBT (No Bus Turn Around) functionality allows zero wait rail for proper operation. Asynchronous inputs include the read-write-read bus utilization Sleep mode enable, ZZ and Output Enable. Output Enable can Fully pin-compatible with both pipelined and flow through be used to override the synchronous control of the output NtRAM, NoBL and ZBT SRAMs drivers and turn the RAM s output drivers off at any time. IEEE 1149.1 JTAG-compatible Boundary Scan Write cycles are internally self-timed and initiated by the rising 2.5 V, or 3.3 V +10%/10% core power supply edge of the clock input. This feature eliminates complex off- LBO pin for Linear or Interleave Burst mode chip write pulse generation required by asynchronous SRAMs Pin-compatible with 2Mb, 4Mb, 8Mb, and 18Mb devices and simplifies input signal timing. Byte write operation (9-bit Bytes) 3 chip enable signals for easy depth expansion The GS8321Z18/32/36AD may be configured by the user to ZZ pin for automatic power-down operate in Pipeline or Flow Through mode. Operating as a JEDEC-standard 165-bump BGA package pipelined synchronous device, in addition to the rising-edge- RoHS-compliant 165-bump BGA package available triggered registers that capture input signals, the device incorporates a rising-edge-triggered output register. For read Functional Description cycles, pipelined SRAM output data is temporarily stored by The GS8321Z18/32/36AD is a 36Mbit Synchronous Static the edge triggered output register during the access cycle and SRAM. GSI s NBT SRAMs, like ZBT, NtRAM, NoBL or then released to the output drivers at the next rising edge of other pipelined read/double late write or flow through read/ clock. single late write SRAMs, allow utilization of all available bus bandwidth by eliminating the need to insert deselect cycles The GS8321Z18/32/36AD is implemented with GSI s high when the device is switched from read to write cycles. performance CMOS technology and is available in JEDEC- standard 165-bump BGA package. Parameter Synopsis -400 -375 -333 -250 -200 -150 Unit t 2.5 2.5 2.5 2.5 3.0 3.8 ns KQ 2.5 2.66 3.3 4.0 5.0 6.7 ns Pipeline tCycle 3-1-1-1 Curr (x18) 395 390 355 280 240 205 mA Curr (x32/x36) 475 455 415 335 280 230 mA t 4.0 4.2 4.5 5.5 6.5 7.5 ns KQ Flow 4.0 4.2 4.5 5.5 6.5 7.5 ns tCycle Through Curr (x18) 290 275 260 235 200 190 mA 2-1-1-1 Curr (x32/x36) 335 320 305 270 240 220 mA Rev: 1.03 8/2013 1/34 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS8321Z18/32/36AD-400/375/333/250/200/150 165 Bump BGAx18 Commom I/OTop View (Package D) 1 2 3 4 5 6 7 8 9 10 11 A NC A E1 BB NC E3 CKE ADV A A A A B NC A E2 NC BA CK W G A A NC B C NC NC V V V V V V V NC DQA C DDQ SS SS SS SS SS DDQ D NC DQB V V V V V V V NC DQA D DDQ DD SS SS SS DD DDQ E NC DQB V V V V V V V NC DQA E DDQ DD SS SS SS DD DDQ F NC DQB V V V V V V V NC DQA F DDQ DD SS SS SS DD DDQ G NC DQB V V V V V V V NC DQA G DDQ DD SS SS SS DD DDQ H FT MCH NC V V V V V NC NC ZZ H DD SS SS SS DD J DQB NC V V V V V V V DQA NC J DDQ DD SS SS SS DD DDQ K DQB NC V V V V V V V DQA NC K DDQ DD SS SS SS DD DDQ L DQB NC V V V V V V V DQA NC L DDQ DD SS SS SS DD DDQ M DQB NC V V V V V V V DQA NC M DDQ DD SS SS SS DD DDQ N DQB NC V V NC NC NC V V NC NC N DDQ SS SS DDQ P NC NC A A TDI A1 TDO A A A NC P R LBO A A A TMS A0 TCK A A A A R 11 x 15 Bump BGA13 mm x 15 mm Body1.0 mm Bump Pitch Rev: 1.03 8/2013 2/34 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

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