X-On Electronics has gained recognition as a prominent supplier of GS8321Z36AGD-250IV sram across the USA, India, Europe, Australia, and various other global locations. GS8321Z36AGD-250IV sram are a product manufactured by GSI Technology. We provide cost-effective solutions for sram, ensuring timely deliveries around the world.

GS8321Z36AGD-250IV

GS8321Z36AGD-250IV electronic component of GSI Technology
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Part No.GS8321Z36AGD-250IV
Manufacturer: GSI Technology
Category:SRAM
Description: SRAM 1.8/2.5V 1M x 36 36M
Datasheet: GS8321Z36AGD-250IV Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

18: USD 85.0942 ea
Line Total: USD 1531.7

Availability - 0
MOQ: 18  Multiples: 18
Pack Size: 18
Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 05 Jun to Fri. 07 Jun

MOQ : 18
Multiples : 18
18 : USD 73.991
54 : USD 73.991
108 : USD 70.84
252 : USD 69.989
504 : USD 68.333
1008 : USD 67.9075
2502 : USD 67.9075

     
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We proudly offer the GS8321Z36AGD-250IV SRAM at competitive prices in the United States, Australia, India, Europe and more. By maintaining strong relationships with manufacturers and optimizing our operations, we provide significant savings to our customers. Customer satisfaction is at the heart of our business. Our knowledgeable and friendly customer service team is always ready to assist you with any inquiries or issues. From product selection to after-sales support, we are dedicated to providing our customers with a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why we are the top choice for the GS8321Z36AGD-250IV SRAM.

GS8321Z18/32/36AD-xxxV 333 MHz150 MHz 165-Bump BGA 36Mb Pipelined and Flow Through 1.8 V or 2.5 V V DD Commercial Temp Synchronous NBT SRAM 1.8 V or 2.5 V I/O Industrial Temp Because it is a synchronous device, address, data inputs, and Features read/ write control inputs are captured on the rising edge of the User-configurable Pipeline and Flow Through mode input clock. Burst order control (LBO) must be tied to a power NBT (No Bus Turn Around) functionality allows zero wait rail for proper operation. Asynchronous inputs include the read-write-read bus utilization Sleep mode enable, ZZ and Output Enable. Output Enable can Fully pin-compatible with both pipelined and flow through be used to override the synchronous control of the output NtRAM, NoBL and ZBT SRAMs drivers and turn the RAM s output drivers off at any time. IEEE 1149.1 JTAG-compatible Boundary Scan Write cycles are internally self-timed and initiated by the rising 1.8 V or 2.5 V core power supply edge of the clock input. This feature eliminates complex off- 1.8 V or 2.5 V I/O supply chip write pulse generation required by asynchronous SRAMs LBO pin for Linear or Interleave Burst mode and simplifies input signal timing. Pin-compatible with 2Mb, 4Mb, 8Mb, and 18Mb devices Byte write operation (9-bit Bytes) The GS8321Z18/32/36AD-xxxV may be configured by the 3 chip enable signals for easy depth expansion user to operate in Pipeline or Flow Through mode. Operating ZZ pin for automatic power-down as a pipelined synchronous device, in addition to the rising- JEDEC-standard 165-bump BGA package edge-triggered registers that capture input signals, the device RoHS-compliant 165-bump BGA package available incorporates a rising-edge-triggered output register. For read cycles, pipelined SRAM output data is temporarily stored by Functional Description the edge triggered output register during the access cycle and The GS8321Z18/32/36AD-xxxV is a 36Mbit Synchronous then released to the output drivers at the next rising edge of Static SRAM. GSI s NBT SRAMs, like ZBT, NtRAM, NoBL clock. or other pipelined read/double late write or flow through read/ single late write SRAMs, allow utilization of all available bus The GS8321Z18/32/36AD-xxxV is implemented with GSI s bandwidth by eliminating the need to insert deselect cycles high performance CMOS technology and is available in when the device is switched from read to write cycles. JEDEC-standard 165-bump FP-BGA package. Parameter Synopsis -333 -250 -200 -150 Unit t 3.0 3.0 3.0 3.8 ns KQ 3.0 4.0 5.0 6.7 ns Pipeline tCycle 3-1-1-1 Curr (x18) 365 290 250 215 mA Curr (x32/x36) 425 345 290 240 mA t 5.0 5.5 6.5 7.5 ns KQ Flow 5.0 5.5 6.5 7.5 ns tCycle Through Curr (x18) 270 245 210 200 mA 2-1-1-1 Curr (x32/x36) 315 280 250 230 mA Rev: 1.03a 12/2020 1/31 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS8321Z18/32/36AD-xxxV 165 Bump BGAx18 Commom I/OTop View (Package D) 1 2 3 4 5 6 7 8 9 10 11 A NC A E1 BB NC E3 CKE ADV A A A A B NC A E2 NC BA CK W G A A NC B C NC NC V V V V V V V NC DQA C DDQ SS SS SS SS SS DDQ D NC DQB V V V V V V V NC DQA D DDQ DD SS SS SS DD DDQ E NC DQB V V V V V V V NC DQA E DDQ DD SS SS SS DD DDQ F NC DQB V V V V V V V NC DQA F DDQ DD SS SS SS DD DDQ G NC DQB V V V V V V V NC DQA G DDQ DD SS SS SS DD DDQ H FT MCH NC V V V V V NC NC ZZ H DD SS SS SS DD J DQB NC V V V V V V V DQA NC J DDQ DD SS SS SS DD DDQ K DQB NC V V V V V V V DQA NC K DDQ DD SS SS SS DD DDQ L DQB NC V V V V V V V DQA NC L DDQ DD SS SS SS DD DDQ M DQB NC V V V V V V V DQA NC M DDQ DD SS SS SS DD DDQ N DQB NC V V NC NC NC V V NC NC N DDQ SS SS DDQ P NC NC A A TDI A1 TDO A A A NC P R LBO A A A TMS A0 TCK A A A A R 11 x 15 Bump BGA13 mm x 15 mm Body1.0 mm Bump Pitch Rev: 1.03a 12/2020 2/31 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

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