2/28/2020 CY14ME064Q2A-SXQ Community English Cart Log in Enter Your Keywords SOLUTIONS PRODUCTS DESIGN SUPPORT BUY & SAMPLE ABOUT CYPRESS Home Products Memories for Embedded Systems nvSRAM nvSRAM Serial CY14ME064Q2A-SXQ CY14ME064Q2A-SXQ Status: In Production Product Specs Pricing & Inventory Packaging/Ordering Quality and RoHS Technical Documents CY14ME064Q2A-SXCY14ME064Q2A-SXQQ DESIGN SUPPORT Automotive Quali ed N Development Kits Density (Kb) 64 Frequency (MHz) 40 Forums Interface SPI Knowledge Base Max. Operating Temp. (C) 105 Packaging Max. Operating VCCQ (V) 3.60 Product Brochures Max. Operating Voltage (V) 5.50 Quality & Reliability Min. Operating Temp. (C) -40 Samples Min. Operating VCCQ (V) 2.70 Technical Support Min. Operating Voltage (V) 4.50 Organization (X x Y) 8Kb x 8 Technical Training Part Family Serial nvSRAM Third Party Network (CYPros) Speed (ns) N/A Tape & Reel N Temp. Classi cation Industrial(Q) TRAINING PRICING & INVENTORY AVAILABILITY Workshops 1-9 unit 10-24 unit 25-99 unit 100-249 unit 250-999 unit 1000+ unit Training On-Demand Price* Price* Price* Price* Price* Price* Webinars 5.49 4.87 4.57 4.28 4.04 3.78 Availability Quantity Ships In Buy from Cypress Buy from Distributors 2/28/2020 CY14ME064Q2A-SXQ Availability Quantity Ships In Buy from Cypress Buy from Distributors Out of Stock 0 Please click here to check lead times Contact Sales Buy * Prices are shown in United States dollars and are for budgetary use only for volume of 1ku PACKAGING/ORDERING Package SOIC No. of Pins 8 Package Dimensions 193 L x 1.5 H x 150 W (Mils) Package Weight 76.45 (mgs) Package Cross Section Drawing Download Package Carrier TUBE Package Carrier Drawing / Orientation Drawing , Package Orientation Standard Pack Quantity 194 Minimum Order Quantity (MOQ) 194 Order Increment 194 Estimated Lead Time (days) 42 HTS Code 8542.32.0041 ECCN (B.2.A.) ECCN Suball 3A991 QUALITY AND ROHS Moisture Sensitivity Level (MSL) 3 Peak Re ow Temp. (C) 260 (Cypress Re ow Pro le) RoHS Compliant Y Print RoHS Certi cate of Compliance PB Free Y Lead/Ball Finish Ni/Pd/Au Marking Cypress Marking Format IPC 1752 Material Declaration IPC1752 MATERIAL DECLARATION SOIC8 (150 mil) (SZ08) OSET Au WIRE NiPdAu HITACHI EN4900G HITACHI CEL9220THF Last Update: Nov 04, 2019 IPC1752 MATERIAL DECLARATION SOIC8 (150 mil) (SZ08) CML Au WIRE NiPdAu HENKEL QMI 509 NITTO MP8500 Last Update: Nov 04, 2019 IPC1752 MATERIAL DECLARATION SOIC8 (150 mil) (SZ08) AMKOR PHIL Au WIRE PURE Sn HENKEL 8290 SUMITOMO EME6600H Last Update: Oct 30, 2019 Device Qualication Reports FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Quali cation Report. QTP 102204: 1MEG (INDUS) SERIAL NON-VOLATILE SRAM PRODUCT FAMILY, S8 TECHNOLOGY, CMI (FAB 4).pdf Last Update: Sep 15, 2016