Product Information

CY62167EV30LL-45BVXIT

CY62167EV30LL-45BVXIT electronic component of Infineon

Datasheet
SRAM 16Mb 3V 45ns 1M x 16 LP SRAM

Manufacturer: Infineon
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 13.984 ea
Line Total: USD 13.98

4732 - Global Stock
Ships to you between
Fri. 17 May to Tue. 21 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4732 - WHS 1


Ships to you between Fri. 17 May to Tue. 21 May

MOQ : 1
Multiples : 1
1 : USD 13.984
10 : USD 13.1675
25 : USD 12.8225
100 : USD 11.546
250 : USD 11.0515
500 : USD 10.9825
1000 : USD 10.787
2000 : USD 10.787
4000 : USD 10.58

9700 - WHS 2


Ships to you between Mon. 13 May to Fri. 17 May

MOQ : 2000
Multiples : 2000
2000 : USD 11.5159

2034 - WHS 3


Ships to you between Mon. 13 May to Fri. 17 May

MOQ : 2
Multiples : 1
2 : USD 19.1181
5 : USD 16.618
10 : USD 15.7356
50 : USD 14.5151
100 : USD 13.7945
200 : USD 13.5669

     
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CY62167EV30 MoBL 16-Mbit (1 M 16 / 2 M 8) Static RAM 16-Mbit (1 M 16 / 2 M 8) Static RAM low active current. Ultra low active current is ideal for providing Features More Battery Life (MoBL ) in portable applications such as cellular telephones. The device also has an automatic power TSOP I package configurable as 1 M 16 or 2 M 8 SRAM down feature that reduces power consumption by 99 percent Very high speed: 45 ns when addresses are not toggling. Place the device into standby mode when deselected (CE HIGH or CE LOW or both BHE and Temperature ranges 1 2 BLE are HIGH). The input and output pins (I/O through I/O ) 0 15 Industrial: 40 C to +85 C are placed in a high impedance state when: the device is Automotive-A: 40 C to +85 C deselected (CE HIGH or CE LOW), outputs are disabled (OE 1 2 Wide voltage range: 2.20 V to 3.60 V HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH), or a write operation is in progress (CE LOW, 1 Ultra-low standby power CE HIGH and WE LOW). 2 Typical standby current: 1.5 A To write to the device, take Chip Enables (CE LOW and CE 1 2 Maximum standby current: 12 A HIGH) and Write Enable (WE) input LOW. If Byte Low Enable Ultra-low active power (BLE) is LOW, then data from I/O pins (I/O through I/O ) is 0 7 written into the location specified on the address pins (A through Typical active current: 2.2 mA at f = 1 MHz 0 A ). If Byte High Enable (BHE) is LOW, then data from the I/O 19 Easy memory expansion with CE , CE , and OE Features 1 2 pins (I/O through I/O ) is written into the location specified on 8 15 the address pins (A through A ). 0 19 Automatic power-down when deselected To read from the device, take Chip Enables (CE LOW and CE 1 2 CMOS for optimum speed and power HIGH) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data Offered in Pb-free 48-ball VFBGA and 48-pin TSOP I packages from the memory location specified by the address pins appears on I/O to I/O . If Byte High Enable (BHE) is LOW, then data from Functional Description 0 7 memory appears on I/O to I/O . See Truth Table on page 12 8 15 The CY62167EV30 is a high performance CMOS static RAM for a complete description of read and write modes. organized as 1M words by 16 bits or 2M words by 8 bits. This For a complete list of related documentation, click here. device features an advanced circuit design that provides an ultra Logic Block Diagram DATA IN DRIVERS A 10 A 9 A 8 A 7 A 1M 16 / 2M x 8 6 A 5 RAM Array I/O I/O 0 7 A 4 A I/O I/O 8 15 3 A 2 A 1 A 0 COLUMN DECODER BYTE BHE CE 2 WE CE 2 CE 1 Power Down CE 1 OE Circuit BHE BLE BLE Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 38-05446 Rev. *N Revised November 19, 2014 ROW DECODER A 11 A 12 A 13 A 14 A 15 A 16 A 17 A 18 A 19 SENSE AMPS CY62167EV30 MoBL Contents Pin Configuration .............................................................3 Ordering Information ...................................................... 13 Product Portfolio ..............................................................3 Ordering Code Definitions ......................................... 13 Maximum Ratings .............................................................4 Package Diagrams .......................................................... 14 Operating Range ...............................................................4 Acronyms ........................................................................16 Electrical Characteristics .................................................4 Document Conventions ................................................. 16 Capacitance ......................................................................5 Units of Measure ....................................................... 16 Thermal Resistance ..........................................................5 Document History Page ................................................. 17 AC Test Loads and Waveforms .......................................5 Sales, Solutions, and Legal Information ...................... 19 Data Retention Characteristics .......................................6 Worldwide Sales and Design Support ....................... 19 Data Retention Waveform ................................................6 Products ....................................................................19 Switching Characteristics ................................................7 PSoC Solutions ...................................................... 19 Switching Waveforms ......................................................8 Cypress Developer Community ................................. 19 Truth Table ......................................................................12 Technical Support ..................................................... 19 Document Number: 38-05446 Rev. *N Page 2 of 19

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
CYP
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION

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