Product Information


IS63WV1024BLL-12TLI-TR electronic component of ISSI

SRAM Chip Async Single 3.3V 1M-bit 128K x 8 12ns 32-Pin TSOP-II T/R

Manufacturer: ISSI
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

1000: USD 3.2818 ea
Line Total: USD 3281.8

0 - Global Stock
MOQ: 1000  Multiples: 1000
Pack Size: 1000
Availability Price Quantity
0 - Global Stock

Ships to you between Wed. 11 Oct to Tue. 17 Oct

MOQ : 1000
Multiples : 1000
1000 : USD 3.2818

Product Category
Memory Size
1 mb it
128 K X 8
Access Time
12 ns
Interface Type
Supply Voltage - Max
3.63 V
Supply Voltage - Min
2.97 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
Package / Case
STSOP I - 32
Supply Current - Max
45 mA
Data Rate
Factory Pack Quantity :
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IS63WV1024BLL IS64WV1024BLL 128K x 8 HIGH-SPEED CMOS STATIC RAM MAY 2012 FEATURES DESCRIPTION High-speed access time: The ISSI IS63/64WV1024BLL is a very high-speed, low power, 131,072-word by 8-bit CMOS static RAM. The 12 ns: 3.3V + 10% IS63/64WV1024BLL is fabricated using ISSI s 15 ns: 2.5V 3.6V high-performance CMOS technology. This highly reliable High-performance, low-power CMOS process process coupled with innovative circuit design CMOS Low Power Operation techniques, yields higher performance and low power 50 mW (typical) operating current consumption devices. 25 W (typical) standby current When CE is HIGH (deselected), the device assumes a Multiple center power and ground pins for standby mode at which the power dissipation can be greater noise immunity reduced down to 25 W (typical) with CMOS input levels. Easy memory expansion with CE and OE options The IS63/64WV1024BLL operates from a single VDD power supply. The IS63/64WV1024BLL is available in CE power-down 32-pin TSOP (Type II), 32-pin sTSOP (Type I), 48-Ball Fully static operation: no clock or refresh miniBGA (6mm x 8mm), and 32-pin SOJ (300-mil) required packages. TTL compatible inputs and outputs Packages available: 32-pin TSOP (Type II) 32-pin sTSOP (Type I) 48-Ball miniBGA (6mm x 8mm) 32-pin 300-mil SOJ Lead-free available FUNCTIONAL BLOCK DIAGRAM 128K X 8 A0-A16 DECODER MEMORY ARRAY VDD GND I/O COLUMN I/O I/O0-I/O7 DATA CIRCUIT CE CONTROL OE CIRCUIT WE Copyright 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized b.) the user assume all such risks and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. 1-800-379-4774 1 Rev. D 05/09/12IS63WV1024BLL IS64WV1024BLL PIN CONFIGURATION PIN CONFIGURATION 32-Pin SOJ 32-Pin TSOP (Type II) (T) 32-Pin sTSOP (Type I) (H) A0 1 32 A16 A1 2 31 A15 A0 1 32 A16 A2 3 30 A14 A1 2 31 A15 A3 4 29 A13 A2 3 30 A14 CE 5 28 OE A3 4 29 A13 CE 5 28 OE I/O0 6 27 I/O7 I/O0 6 27 I/O7 I/O1 7 26 I/O6 I/O1 7 26 I/O6 VDD 8 25 GND VDD 8 25 GND GND 9 24 VDD GND 9 24 VDD I/O2 10 23 I/O5 I/O2 10 23 I/O5 I/O3 11 22 I/O4 I/O3 11 22 I/O4 WE 12 21 A12 WE 12 21 A12 A4 13 20 A11 A5 14 19 A10 A4 13 20 A11 A6 15 18 A9 A5 14 19 A10 A7 16 17 A8 A6 15 18 A9 A7 16 17 A8 PIN DESCRIPTIONS PIN CONFIGURATION 48-mini BGA (B) (6 mm x 8 mm) A0-A16 Address Inputs CE Chip Enable Input 1 2 3 4 5 6 OE Output Enable Input WE Write Enable Input I/O0-I/O7 Bidirectional Ports VDD Power A2 A6 A7 A NC OE NC GND Ground I/O NC A1 A5 B 1 CE I/O8 I/O NC A0 A4 NC I/O C 2 7 GND NC NC A3 NC VDD D VDD NC NC NC NC GND E I/O3 NC A14 A11 I/O5 I/O F 6 A15 I/O NC A12 WE A8 G 4 NC A10 A16 A13 A9 NC H 2 Integrated Silicon Solution, Inc. 1-800-379-4774 Rev. D 05/09/12

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
Integrated Silicon Solution
Integrated Silicon Solution ()
Integrated Silicon Solution (ISSI)
ISSI(Integrated Silicon Solution)
ISSI, Integrated Silicon Solution Inc