IS66WVE2M16DBLL IS67WVE2M16DBLL 3.0V Core Async/Page PSRAM Overview The IS66WVE2M16DBLL and IS67WVE2M16DBLL is an integrated memory device containing 32Mbit Pseudo Static Random Access Memory using a self-refresh DRAM array organized as 2M words by 16 bits. The device includes several power saving modes : Partial Array Refresh mode where data is retained in a portion of the array and Deep Power Down mode. Both these modes reduce standby current drain. The die has separate power rails, VDDQ and VSSQ for the I/O to be run from a separate power supply from the device core. Features Asynchronous and page mode interface Low Power Feature Dual voltage rails for optional performance Temperature Controlled Refresh VDD 2.7V~3.6V, VDDQ 2.7V~3.6V Partial Array Refresh Page mode read access Deep power-down (DPD) mode Interpage Read access : 70ns Operating temperature Range Intrapage Read access : 20ns Industrial: -40C~85C Automotive A1: -40C~85C Low Power Consumption Package: Asynchronous Operation < 30 mA 48-ball TFBGA Intrapage Read < 18mA Standby < 150 uA (max.) Deep power-down (DPD) < 3uA (Typ) Copyright 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized b.) the user assume all such risks and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances 1 Rev. D Oct. 2013 www.issi.com - SRAM issi.com IS66WVE2M16DBLL IS67WVE2M16DBLL General Description PSRAM products are high-speed, CMOS pseudo-static random access memory developed for low-power, portable applications. The 32Mb DRAM core device is organized as 2 Meg x 16 bits. These devices include the industry-standard, asynchronous memory interface found on other low-power SRAM or pseudo-SRAM (PSRAM) offerings. For seamless operation on an asynchronous memory bus, PSRAM products incorporated a transparent self-refresh mechanism. The hidden refresh requires no additional support from the system memory controller and has no significant impact on device read/write performance. A user-accessible configuration registers (CR) defines how the PSRAM device performs on- chip refresh and whether page mode read accesses are permitted. This register is automatically loaded with a default setting during power-up and can be updated at any time during normal operation. Special attention has been focused on current consumption during self-refresh. This product includes two system-accessible mechanisms to minimize refresh current. Setting sleep enable (ZZ ) to LOW enables one of two low-power modes: partial-array refresh (PAR) or deep power-down (DPD). PAR limits refresh to only that part of the DRAM array that contains essential data. DPD halts refresh operation altogether and is used when no vital information is stored in the device. The system-configurable refresh mechanisms are accessed through the CR. A0~A20 Address Decode Logic Input 2048K X 16 /Output DRAM Mux Memory Array And Configuration Register Buffers (CR) CE WE Control OE Logic LB UB ZZ DQ0~DQ15 Functional Block Diagram 2 Rev. D Oct. 2013 www.issi.com - SRAM issi.com