5.0mm x 5.0mm FULL-COLOR SURFACE MOUNT LED LAMP Part Number: AAAF5051-04 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING Blue ELECTROSTATIC Reddish-Orange DISCHARGE Green SENSITIVE DEVICES Features Descriptions z Chips can be controlled separately. z The Blue source color devices are made with InGaN on z Suitable for all SMT assembly and solder process. Al2O3 substrate Light Emitting Diode. z Available on tape and reel. z The Reddish-Orange source color devices are made with z White SMD package, silicone resin. AlGaInP on AlN substrate Light Emitting Diode. z Package: 500pcs / reel. z The Green source color devices are made with InGaN on z Moisture sensitivity level : level 3. Al2O3 substrate Light Emitting Diode. z RoHS compliant. z Electrostatic discharge and power surge could damage the LEDs. z It is recommended to use a wrist band or anti- electrostatic glove when handling the LEDs. z All devices, equipments and machineries must be electrically grounded. Package Dimensions R Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.15 0.006 unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAM7047 REV NO: V.4B DATE: SEP/16/2014 PAGE: 1 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP : 1201008410 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H S might corrode silver plating of 2 leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. SPEC NO: DSAM7047 REV NO: V.4B DATE: SEP/16/2014 PAGE: 2 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP : 1201008410