Product Information

LB03B25WYT\500

LB03B25WYT\500 electronic component of Kyocera AVX

Datasheet
Thermal Interface Products 0402 BeO .025T

Manufacturer: Kyocera AVX
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

Stock Image

LB03B25WYT\500
Kyocera AVX

1 : USD 7.1428
10 : USD 4.7385
100 : USD 3.6972
250 : USD 3.6036
500 : USD 3.276
1000 : USD 2.9952
2500 : USD 2.7612
5000 : USD 2.7612
10000 : USD 2.7495
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Type
Package / Case
Material
Length
Width
Thickness
Series
Packaging
Thermal Resistance
Brand
Product Type
Factory Pack Quantity :
Subcategory
Hts Code
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Bridge Thermal Conductor A /Xs new -Bridge Thermal Conductor is manufactured with the highest quality materials for reliable and repeatable performance providing a cost effective thermal management solution. These devices are constructed with Aluminum Nitride (AlN) or Beryllium Oxide (BeO) and are available in standard EIA form factors. -Bridge provides the designer with the ability to manage thermal conditions by directing heat to a thermal ground plane, heat sink or any other specific thermal point of interest. The inherently low capacitance makes this device virtually transparent at RF/microwave frequencies. This device has the added benefit of offering additional layers of protection to adjacent components from hot spot thermal loads. -Bridge provides the benefit of increased overall circuit reliability. A /Xs -Bridge is manufactured using one-piece construction, providing a RoHS compliant SMT package that is fully compatible with high speed automated pick-and- place processing. It is available in 0302, 0402, 0603 and 0805 EIA case sizes. Custom configurations are also available. FEATURES APPLICATIONS FUNCTIONAL APPLICATIONS High Thermal Conductivity GaN Power Amplifiers Between active device and adjacent ground planes Low Thermal Resistance High RF Power Ampliefi rs Specific contact pad to case Low Capacitance Filters Contact pad to contact pad Increases Circuit Reliability Synthesizers Direct component contact to via pad or trace RoHS Compliant Industrial Computers Edges fully metalized More efficient thermal Switch Mode Power management Supplies Pin & Laser Diodes HOW TO ORDER LB 03 A 25 W H T -Bridge Case Size Substrate Thickness Style Termination Packaging OS = 0302 A = AIN (mils) W = Edge Wrap Y = Silver Platinum, T = 1000pcs., 7 reel 02 = 0402 B = BeO E = No Wrap non-magnetic Termination T 500 = 500pcs., 7 reel 03 = 0603 S = Silver over Magnetic C = Matrix Tray 05 = 0805 Termination Consult factory for other termination options e.g., tin plate and solder plate Standard Thickness Size Length Width Termination (T, mils) (EIA) (L) (W) (t) T1 T2 0.77 0.051 0.51 0.051 0.25 0.051 0302 20 15 (0.030 0.002) (0.020 0.002) (0.010 0.002) 1.02 0.051 0.51 0.051 0.25 0.051 0402 20 15 (0.040 0.002) (0.020 0.002) (0.010 0.002) 0.52 0.051 0.76 0.051 0.38 0.051 0603 25 20 (0.060 0.002) (0.030 0.002) (0.015 0.002) 2.03 0.051 1.27 0.051 0.51 0.051 0805 40 25 (0.080 .002) (0.050 0.002) (0.020 0.002) Thermal Resistance (C/W) Thermal Conductivity (mW/C) Capacitance Value (pF)* AlN Case Size Thickness T1 Thickness T2 Thickness T1 Thickness T2 Thickness T1 Thickness T2 0302 19 24 53 41 0.08 0.07 0402 25 32 40 30 0.06 0.05 0603 20 25 50 40 0.08 0.06 0805 10 16 100 60 0.13 0.08 BeO Thermal Resistance (C/W) Thermal Conductivity (mW/C) Capacitance Value (pF)* Case Size Thickness T1 Thickness T2 Thickness T1 Thickness T2 Thickness T1 Thickness T2 0302 12 15 81 63 0.07 0.06 0402 16 21 61 46 0.05 0.04 0603 13 16 76 61 0.06 0.05 0805 7 11 153 92 0.10 0.07 91 101718X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for Thermal Interface Products category: Click to view products by Kyocera AVX manufacturer: Other Similar products are found below : 7721-9PPS FGN80-2 PFM-172-60 A-40 174-9-230P 9601-7 5300AC 1.500G 08133 V6622C TVQF-1225-07S TP0001 4860 SC80-W2 A17713-06 A17713-05 A17690-06 A17775-03 A17690-05 A17653-02 A17690-04 A17775-05 A17775-06 A17690-08 A17690-02 A17689-06 A17653-06 A17690-12 A17653-03 A17689-03 A17752-04 A17752-07 A17634-12 19-36565-0001-1 A17752-09 22000-001A A17752-20 A17752-12 A17653-04 A17634-10 A17634-07 A17633-07 A17156-02 TA-1.75 30195 V6516A SPT400-12-13.5-25 189651F00000G A17883-07 A17883-08 A17883-14

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
American Technical Ceramics
American Technical Ceramics (ATC)
American Technical Ceramics (ATC) / AVX
ATC
ATC / Kyocera AVX
ATC DIVERSIFIED ELECTRONICS
AVX
AVX Kyocera
AVX (FORMERLY KNOWN AS NICHICON)
AVX / Kyocera
AVX Connectors
AVX Corp/Kyocera Corp
AVX Corporation
AVX INTERCONNECT
ELCO / AVX
Ethertronics
Ethertronics / AVX
ethertronics / kyocera avx
Ethertronics Inc
Ethertronics Inc.
ETHERTRONICS/AVX
ETHERTRONICS/KYOCERA AVX
Kyocera
kyocera avx
KYOCERA AVX Components
Kyocera Electronic Components
Kyocera Industrial Ceramics Corporation
KYOCERA INTERNATIONAL, INC.

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