Product Information

450-0168R

450-0168R electronic component of Laird Connectivity

Datasheet
Bluetooth Modules - 802.15.1 RF Module, Sterling- LWB5, U.FL

Manufacturer: Laird Connectivity
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 36.3374 ea
Line Total: USD 36.34

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 23 May to Wed. 29 May

MOQ : 1
Multiples : 1

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450-0168R
Laird Connectivity

1 : USD 36.3374

0 - WHS 2


Ships to you between Thu. 23 May to Wed. 29 May

MOQ : 1000
Multiples : 1000

Stock Image

450-0168R
Laird Connectivity

1000 : USD 48.3819

0 - WHS 3


Ships to you between Wed. 29 May to Fri. 31 May

MOQ : 1000
Multiples : 1000

Stock Image

450-0168R
Laird Connectivity

1000 : USD 41.8229

     
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Sterling-LWB5 Module Datasheet Integrated 802.11 a/b/g/n/ac WLAN, Bluetooth & BLE Module FEATURES DESCRIPTION The Sterling-LWB5 is a high performance 2.4 GHz IEEE 802.11 a/b/g/n/ac (single stream n) and 5 GHz WLAN and Bluetooth Smart Ready Typical WLAN Transmit Power: combo module based on latest-generation silicon o +16 dBm, 11 Mbps, CCK (b) (Cypresss BCM43353). With an industrial o +13 dBm, 54 Mbps, OFDM (g) temperature rating, broad country certifications, o +11 dBm, HT20 MCS7 (n) and the availability of two different package styles, Typical WLAN Sensitivity: the Sterling-LWB5 provides significant flexibility to o -87 dBm, 8% PER,11 Mbps (b) meet various end user application needs. o -73 dBm, 10% PER, 54 Mbps (g) o -71 dBm, 10% PER, MCS7 (n) The on-module chip antenna package style for the Bluetooth 2.1+EDR, Bluetooth 3.0, Sterling-LWB5 eliminates complexity for design Bluetooth 4.2 (Bluetooth Low Energy) integration, simplifies manufacturing assembly with WLAN and Bluetooth coexistence larger pin outs, and features an advanced chip Available in two footprint styles: antenna that offers greater resistance to de-tuning o Easy to Integrate: 15.5 mm x 21 mm than typical trace or chip antennas. o Miniature footprint: 10 mm x 10 mm Available with integrated chip antenna or U.FL connector for external antenna Operating voltage: VBAT = 3.20V to 3.60V VDDIO = 1.71V to 1.89V o Operating temperature: -40 to +85 C Compact design based on Cypress BCM43353 SoC EMC Compliance: FCC (USA), IC (Canada), & ETSI (Europe) BT SIG QDID: 97564 REACH and RoHS compliant The module includes the MAC, Baseband and Radio to support WLAN applications and an independent, APPLICATIONS high-speed UART is provided for the Bluetooth host interface. In addition, the latest Linux and Android Security & Building Automation drivers are supported directly by LSR and Cypress. Internet of Things / M2M Connectivity Need to get to market quickly Not an expert in Smart Gateways 802.11. Need a custom antenna Would you like to own the design Would you like a custom design Not quite sure what you need Do you need help with your host board LSR Design Services will be happy to develop custom hardware or software, or assist with integrating the design. Contact us at sales lsr.com or call us at 262-375-4400. The information in this document is subject to change without notice. 330-0208-R2.1 Copyright 2016-2018 LSR Page 1 of 80 Sterling-LWB5 Module Datasheet TABLE OF CONTENTS FEATURES ................................................................................................................................... 1 APPLICATIONS ............................................................................................................................ 1 DESCRIPTION .............................................................................................................................. 1 MODULE VARIANTS .................................................................................................................... 5 FUNCTIONAL FEATURES .............................................................................................................. 8 WLAN Features ...................................................................................................................................................... 8 Bluetooth Features ................................................................................................................................................ 8 Wireless Security System Features ........................................................................................................................ 8 ORDERING INFORMATION .......................................................................................................... 9 MODULE ACCESSORIES .............................................................................................................. 10 APPLICABLE DOCUMENTS ......................................................................................................... 10 BLOCK DIAGRAMS ..................................................................................................................... 11 SIP MODULE FOOTPRINT AND PIN DEFINITIONS ........................................................................ 14 SIP MODULE PIN DESCRIPTIONS ................................................................................................ 15 U.FL AND CHIP ANTENNA MODULE FOOTPRINT AND PIN DEFINITIONS ...................................... 18 U.FL AND CHIP ANTENNA MODULE PIN DESCRIPTIONS .............................................................. 19 MODULE POWER STATES .......................................................................................................... 21 MODULE PIN I/O STATES ........................................................................................................... 22 ELECTRICAL SPECIFICATIONS ..................................................................................................... 25 Absolute Maximum Ratings ................................................................................................................................. 25 Recommended Operating Conditions .................................................................................................................. 25 General Characteristics ........................................................................................................................................ 26 WLAN Power Consumption.................................................................................................................................. 27 Bluetooth Power Consumption ............................................................................................................................ 28 Power Supply Requirements ................................................................................................................................ 28 Power Supply Sequencing .................................................................................................................................... 29 The information in this document is subject to change without notice. 330-0208-R2.1 Copyright 2016-2018 LSR Page 2 of 80

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits
Laird - Embedded Wireless Solutions
Laird / LS Research
Laird Connectivity
Laird Technologies EMI
Laird Technologies IAS
Laird Technologies Wireless M2M

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