71012-511 Laird Connectivity

Ceramic Plate Series CP10-254-06 Thermoelectric Modules The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered the standard in the thermoelectric industry. This broad product line of high-performance and highly reliable TEMs is available in numerous heat pumping capacities, geometric shapes, and input power ranges. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the CP Series is designed for higher current and large heat-pumping applications. FEATURES APPLICATIONS Americas: +1.919.597.7300 Precise temperature control Medical lasers Europe: +46.31.420530 Compact geometric sizes Lab science instrumentation Asia: +86.755.2714.1166 Reliable solid state operation Clinical diagnostics systems ets.sales lairdtech.com No sound or vibration Photonics laser systems www.lairdtech.com Environmentally friendly Electronic enclosure cooling DC operation Food & beverage cooling Chillers (liquid cooling) RoHS compliant SPECIFICATIONS TECHNICAL Hot Side Temperature (C) 25C 50C Qmax (Watts) 52.9 58.1 Delta Tmax (C) 67 75 Imax (Amps) 3.0 3.0 Vmax (Volts) 29.0 32.9 Module Resistance (Ohms) 8.69 9.80 SUFFIX THICKNESS FLATNESS & HOT FACE COLD FACE LEAD LENGTH (PRIOR TO PARALLELISM TINNING) L 0.1500.010 0.002/0.002 Lapped Lapped 4.5 L1 0.1500.001 0.001/0.001 Lapped Lapped 4.5 L2 0.1500.0005 0.0005/0.0005 Lapped Lapped 4.5 ML 0.1540.010 0.002/0.002 Metallized Lapped 4.5 LM 0.1540.010 0.002/0.002 Lapped Metallized 4.5 MM 0.1580.010 0.002/0.002 Metallized Metallized 4.5 SEALING OPTIONS SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION RT RTV White -60 to 204 C Non-corrosive, silicone adhesive EP Epoxy Black -55 to 150 C Low density syntactic foam epoxy encapsulant Page 1 of 3 CP10-254-06 Performance Curves at Th =25C THERMO ELECTRIC Page 2 of 3