Product Information

A12616-19

A12616-19 electronic component of Laird Connectivity

Datasheet
Thermal Interface Products Tflex 620 DC1 9x9" 3.0W/mK gap filler
Manufacturer: Laird Connectivity
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 46.2593 ea
Line Total: USD 46.26

66 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
68 - WHS 1


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

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A12616-19
Laird Connectivity

1 : USD 47.7154
10 : USD 45.4355
25 : USD 45.3982
50 : USD 43.2802
100 : USD 39.9414

Read More Specifications

     
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RoHS - XON
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Additional Infomation About Product

Tflex 600 Series Thermal Gap Filler Product Description TM Tflex 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. Tflex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex 600 is electrically insulating, stable from 45C to 200C and meets UL 94 V0 *Ready for 5G rating. FEATURES AND BENEFITS Very high compliancy for low stress applications 3 W/mK thermal conductivity Available in thicknesses from 0.020 - 0.200 (0.5mm - 5.0mm) Naturally tacky, needs no further adhesive coating SPECIFICATIONS TYPICAL PROPERTIES VALUE TEST METHOD Construction & Composition Ceramic filled silicone sheet N/A Color Blue-Viloet Visual Thickness Range 0.50mm (0.020) - 5.08mm (0.20) N/A Thermal Conductivity (W/mK) 3.0 ASTM D5470 Density (g/cc) 1.34 Helium Pyncometer Hardness (Shore 00) 51 ASTM D2240 Outgassing TML (weight %) 0.13 ASTM E595 Outgassing CVCM (weight %) 0.05 ASTM E595 Temperature Range -45C to 200C N/A 0 Rth 40 mils, 10 psi, 50 C 0.62Cin2/W ASTM D5470 (modified) Dielectric Constant 10GHz 4.0 ASTM D150 UL Flammability Rating V-0 UL 94 Volume Resistivity (ohm-cm) 2 x 10 13 ASTM D257 Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com Tflex 600 Series Thermal Gap Filler Tflex 600 Deflection vs Pressure 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 5 psi 10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi Tflex 640 Tflex 680 Tflex 6100 Tflex 6160 Tflex 6200 Tflex 600 Thermal Resistance vs Pressure 4.00 C-in2/W 3.50 C-in2/W 3.00 C-in2/W 2.50 C-in2/W 2.00 C-in2/W 1.50 C-in2/W 1.00 C-in2/W 0.50 C-in2/W 0.00 C-in2/W 10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi Tflex 640 Tflex 680 Tflex 6100 Tflex 6160 AVAILABILITY STANDARD THICKNESSES 0.5mm (0.020) to 5.0mm (0.200) thick material available in 0.25mm (0.010) increments Available in standard sheet sizes of 18 x 18 and 9 x 9 or custom die cut parts OPTIONS DC1 proprietary tack eliminated coating PART NUMBER SYSTEM Tflex indicates Laird elastomeric thermal gap filler product line. 6xx indicates Tflex 600 product line with thickness in mils (0.001) EXAMPLES: Tflex 640 = 0.040 inch thick Tflex 600 material Tflex 680DC1 = 0.080 inch thick Tflex 600 material with DC1 coating Tflex 600 DS 071718 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.

HS Compliance

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper

Laird Connectivity may also be referenced as

Laird - Embedded Wireless Solutions
Laird / LS Research
Laird Connectivity
Laird Technologies EMI
Laird Technologies IAS
Laird Technologies Wireless M2M

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