X-On Electronics has gained recognition as a prominent supplier of A15796-28 THERMAL INTERFACE PRODUCTS across the USA, India, Europe, Australia, and various other global locations. A15796-28 THERMAL INTERFACE PRODUCTS are a product manufactured by Laird Connectivity. We provide cost-effective solutions for THERMAL INTERFACE PRODUCTS, ensuring timely deliveries around the world.

A15796-28 Laird Connectivity

A15796-28 electronic component of Laird Connectivity
Images are for reference only
See Product Specifications
Part No.A15796-28
Manufacturer: Laird Connectivity
Category: Thermal Interface Products
Description: Thermal Interface Products Tflex 7200 9x9" 5.0W/mK gap filler
Datasheet: A15796-28 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 515.9239 ea
Line Total: USD 515.92

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 21 Jun to Thu. 27 Jun

MOQ : 1
Multiples : 1
1 : USD 630.5706
10 : USD 544.9762
25 : USD 506.0566

   
Manufacturer
Product Category
Thermal Conductivity
Thickness
Brand
Conductive Material
External Length
External Width
Product Range
Svhc
Insulator Body Material
Volume Resistivity
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We are delighted to provide the A15796-28 from our Thermal Interface Products category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the A15796-28 and other electronic components in the Thermal Interface Products category and beyond.

Tflex 700 Series Thermal Gap Filler HIGHEST THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex 700 is stable from -45C thru 200C and meets UL 94V0 flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal performance. FEATURES AND BENEFITS APPLICATIONS Cooling components to chassis, frame Thermal conductivity 5.0 W/mK or other mating components Highly compliant Mass storage devices Low thermal resistance even at low pressure Heat pipe thermal solutions for notebook computers Available in thicknesses from 0.020 thru 0.200 (0.5mm thru 5.0mm) Automotive engine control Naturally tacky for adhesion during Telecommunication hardware assembly and transport LED solid state lighting Power electronics Flat panel displays Audio and video components Computer servers and other IT infrastructure GPS navigation and other portable devices Americas: +1.800.843.4556 Europe: +49.8031.24600 Asia: +86.755.2714.116 CLV-customerservice lairdtech.com Tflex 700 Series Thermal Gap Filler Tflex 700 TEST METHOD Construction Filled Silicone Sheet N/A Color Dark Grey Visual Thermal Conductivity (W/mK) 5.0 Hot Disk Hardness (Shore 00) 66 3 ASTM D2240 Specific Gravity 1.73 Helium Pyncometer Thickness Range 0.020 - .200 (0.5 - 5.0mm) Thickness Tolerance 10% UL Flammability Rating 94 V0 File E180840 Temperature Range -45C to 200C See reliability report 13 Volume Resistivity (ohm-cm) 1 x 10 ASTM D257 Outgassing TML 1.0% ASTM E595 Outgassing CVCM 0.13% ASTM E595 STANDARD THICKNESSES Standard thickness 0.020 (0.5mm) through 0.200 (5.0mm) available in 0.010 (0.25mm) increments. MATERIAL NAME AND THICKNESS Tflex - indicates elastomeric gap filler product line. 7XXX - indicates Tflex 700 product line and thickness in mils (0.001-inches). -DC1 - one side tacky default is both sides tacky. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. THR-DS-TFLEX-700 07 2 14 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. A15955-00 Rev E, 7/2014.

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
Laird / LS Research
Laird Connectivity
Laird Technologies EMI
Laird Technologies IAS
Laird Technologies Wireless M2M

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