A15973-20

TM Tflex 300TG Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE The high rate of compliancy of Tflex 300TG allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures. A Tgard silicone liner has been added to the Tflex 300TG to offer a guaranteed dielectric barrier. The Tgard is cut-through resistant and provides easier part handling in mass production. FEATURES AND BENEFITS Extreme compliancy allows material to totally blanket component(s) Thermal conductivity of 1.2 W/mK Provides a dielectric barrier Low compression set enables the pad to be reused many times APPLICATIONS Notebook and desktop computers Telecommunication hardware Flat panel displays Memory modules Power conversion equipment Set top box Lighting ballast Automotive electronics LED lighting Handheld electronics Optical disk drives Vibration dampening global solutions: local support TM Americas: +1.888.246.9050 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice lairdtech.com www.lairdtech.com/thermalTM Tflex 300TG Series Thermal Gap Filler Innovative Technology for a Connected World TM Tflex 300TG TYPICAL PROPERTIES Deflection (%) vs Pressure (psi) TM Tflex 300TG TEST METHOD 80.0 70.0 Filled silicone elastomer 60.0 Construction NA on carrier line 40 mils 50.0 80 mils Color Light green Visual 100 mils 40.0 120 mils 0.020 - .200 in 30.0 190 mils Thickness Range (0.5 - 5.0 mm), 20.0 0.250 in (6.4 mm) 10.0 Thickness Tolerance 10% 0.0 Surface Adhesion 1 side 10 psi 20 psi 40 psi 60 psi 80 psi 100 psi Pressure, psi Specific Gravity 1.79 ASTM D792 Hardness (Shore 00) 27 ASTM D2240 Thermal Conductivity 1.2 W/mK ASTM D5470 STANDARD THICKNESSES Thermal Resistance, ASTM D5470 0.020 to 0.200 in (0.5 to 5.0 mm)* 2 1.59 C in /W 10 psi modified 0.020 to 0.200 in thick material available in 0.010 inch (0.25 mm) increments Coefficient of Thermal IPC-TM-650 600 ppm/C *0.250 in (6.4 mm) thickness is available Expansion (CTE) 2.4.24 Operating Temperature MATERIAL NAME AND THICKNESS -40C to 160C Range Tflex indicates elastomeric gap filler product line Breakdown Voltage >10,000 VAC ASTM D149 3xxx indicates high recovery 3 series 1.2 W/mK material TG indicates Tgard liner Flammability Rating 94V0 UL Outgassing, TML 0.56% ASTM E595 EXAMPLES Outgassing, CVCM 0.10% ASTM E595 Tflex 3120TG = 0.120 in thick material with Tgard liner THR-DS-TFLEX-300TG 0611 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Respon - sibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2011 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Document A16543-00 Rev A, 06/2011. Percent Deflection