CP14,31,045,L,W4.5 Laird Connectivity

Ceramic Plate Series CP14-35-045 Thermoelectric Modules The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered the standard in the thermoelectric industry. This broad product line of high-performance and highly reliable TEMs is available in numerous heat pumping capacities, geometric shapes, and input power ranges. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the CP Series is designed for higher current and large heat-pumping applications. FEATURES APPLICATIONS Precise temperature control Medical lasers Americas: +1.919.597.7300 Compact geometric sizes Lab science instrumentation Europe: +46.31.420530 Reliable solid state operation Clinical diagnostics systems Asia: +86.755.2714.1166 No sound or vibration Photonics laser systems ets.sales lairdtech.com www.lairdtech.com Environmentally friendly Electronic enclosure cooling Food & beverage cooling DC operation Chillers (liquid cooling) RoHS compliant SPECIFICATIONS TECHNICAL Hot Side Temperature (C) 25C 50C Qmax (Watts) 20.4 22.5 Delta Tmax (C) 68 75 Imax (Amps) 8.7 8.7 Vmax (Volts) 4.0 4.5 Module Resistance (Ohms) 0.43 0.48 SUFFIX THICKNESS FLATNESS & HOT FACE COLD FACE LEAD LENGTH (PRIOR TO PARALLELISM TINNING) L 0.1310.010 0.0015/0.0015 Lapped Lapped 4.5 L1 0.1310.001 0.001/0.001 Lapped Lapped 4.5 L2 0.1310.0005 0.0005/0.0005 Lapped Lapped 4.5 ML 0.1350.010 0.002/0.002 Metallized Lapped 4.5 LM 0.1350.010 0.002/0.002 Lapped Metallized 4.5 MM 0.1390.010 0.002/0.002 Metallized Metallized 4.5 SEALING OPTIONS SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION RT RTV White -60 to 204 C Non-corrosive, silicone adhesive EP Epoxy Black -55 to 150 C Low density syntactic foam epoxy encapsulant Page 1 of 3 CP14-35-045 Performance Curves at Th =25C THERMO ELECTRIC Page 2 of 3