Product Information

OTH-Q246723E-00-B5

OTH-Q246723E-00-B5 electronic component of Laird Performance Materials

Datasheet
EMI Gaskets Sheets Absorbers & Shielding
Manufacturer: Laird Performance Materials
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 16.3204 ea
Line Total: USD 16.32

97 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
97 - WHS 1


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

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OTH-Q246723E-00-B5
Laird Performance Materials

1 : USD 16.3329
10 : USD 15.4359
25 : USD 15.1493
50 : USD 13.2183
100 : USD 13.0439
250 : USD 12.9193
500 : USD 12.7823
1000 : USD 12.5331
2500 : USD 12.5206

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Additional Infomation About Product

TM Tflex SF800 Series Silicone Free Thermal Gap Filler PRODUCT DESCRIPTION Tflex SF800 is a high-performance, compliant, silicone free thermal interface material. By coupling extremely high thermal conductivity with exceptional wetting characteristics, Tflex SF800 provides some of the lowest thermal resistance values in the industry. This makes it well- suited for applications where silicone based pads are traditionally used as well as those applications which are silicone sensitive. Tflex SF800 is naturally tacky on both sides requiring no additional adhesive coating, which would inhibit thermal performance. The natural tack allows for the pad to be held in place during assembly. FEATURES AND BENEFITS Silicone-free gap filler Thermal Conductivity of 7.8 W/mK Exceptionally low thermal resistance Environmentally friendly solution that meets regulatory requirements including RoHS and REACH SPECIFICATIONS PROPERTIES TYPICAL VALUE TEST METHOD Construction & Composition Ceramic filled silicone free N/A sheet Color Grey Visual Thickness Range 0.50mm (0.020) 4.0mm (0.16) N/A Thermal Conductivity (W/mK) 7.8 ASTM D5470 Density (g/cc) 3.21 Helium Pycnometer Hardness (Shore 00) 81 ASTM D2240 < 0.2 Weight Loss over time TGA 120C, 168 hrs (%) Temperature Range -25C to 120C Laird Test Method Rth 40 mils, 10 psi 0.237 Cin2/W ASTM D5470 (Modified) Dielectric Constant 1 MHz 16 ASTM D150 UL Flammability Rating V-0 UL 94 12 Volume Resistivity 5 x 10 ohm-cm ASTM D257 Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.comTM Tflex SF800 Series Silicone Free Thermal Gap Filler Tflex SF800 Thermal Resistance vs Pressure 0.700 C-in2/W 0.600 C-in2/W 0.500 C-in2/W 0.400 C-in2/W 0.300 C-in2/W 0.200 C-in2/W 0.100 C-in2/W 0.000 C-in2/W 10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi Tflex SF820 Tflex SF840 Tflex SF860 Tflex SF880 Tflex SF8100 Tflex SF800 Deflection vs Pressure 30% 25% 20% 15% 10% 5% 0% 0 psi 20 psi 40 psi 60 psi 80 psi 100 psi 120 psi SF820 SF840 SF860 SF880 SF8100 AVAILABILITY STANDARD THICKNESSES 0.5mm (0.020) to 4.0mm (0.160) thick material available in 0.25mm (0.010) increments Available in standard sheet sizes of 9 x 9 or custom die cut parts PART NUMBER SYSTEM Tflex indicates Laird elastomeric thermal gap filler product line. SF8xxx indicates Tflex SF800 product line with thickness in mils (0.001) EXAMPLES: Tflex SF840 = 0.040 thick Tflex SF800 material Tflex SF800 DS 041519 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. Copyright 2013 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.

HS Compliance

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper

Laird Performance Materials may also be referenced as

Laird
Laird Performance Materials
Laird Technologies
Laird-Signal Integrity Products
LRD
STEWARD/LAIRD TECH

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