X-On Electronics has gained recognition as a prominent supplier of LA4128V-75TN100E cpld - complex programmable logic devices across the USA, India, Europe, Australia, and various other global locations. LA4128V-75TN100E cpld - complex programmable logic devices are a product manufactured by Lattice. We provide cost-effective solutions for cpld - complex programmable logic devices, ensuring timely deliveries around the world.

LA4128V-75TN100E

LA4128V-75TN100E electronic component of Lattice
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Part No.LA4128V-75TN100E
Manufacturer: Lattice
Category:CPLD - Complex Programmable Logic Devices
Description: Lattice CPLD - Complex Programmable Logic Devices Auto Grade (AEC-Q100 ) ispMACH4128V
Datasheet: LA4128V-75TN100E Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 48.3146 ea
Line Total: USD 48.31

Availability - 80
Ships to you between
Thu. 06 Jun to Mon. 10 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
80 - WHS 1


Ships to you between Thu. 06 Jun to Mon. 10 Jun

MOQ : 1
Multiples : 1
1 : USD 47.035
25 : USD 44.7005
90 : USD 44.7005
1080 : USD 44.7005
10080 : USD 44.7005
50040 : USD 44.689

     
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LA-ispMACH 4000V/Z Automotive Family 3.3 V/1.8 V In-System Programmable SuperFAST High Density PLDs Data Sheet FPGA-DS-02021 Version 2.6 September 2017 LA-ispMACH 4000V/Z Automotive Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 5 1. Features ........................................................................................................................................................................ 6 2. Introduction .................................................................................................................................................................. 7 3. Overview ....................................................................................................................................................................... 8 4. Architecture .................................................................................................................................................................. 9 Generic Logic Block ............................................................................................................................................. 9 AND Array ............................................................................................................................................................ 9 Enhanced Logic Allocator .................................................................................................................................. 10 Product Term Allocator ...................................................................................................................................... 11 Cluster Allocator ................................................................................................................................................ 11 Wide Steering Logic ........................................................................................................................................... 11 Macrocell ........................................................................................................................................................... 12 Enhanced Clock Multiplexer .............................................................................................................................. 12 Clock Enable Multiplexer ................................................................................................................................... 13 Initialization Control .......................................................................................................................................... 13 GLB Clock Generator ......................................................................................................................................... 13 Output Routing Pool (ORP) ............................................................................................................................... 14 Output Routing Multiplexers ............................................................................................................................. 14 ORP Bypass and Fast Output Multiplexers ........................................................................................................ 15 Output Enable Routing Multiplexers ................................................................................................................. 15 5. I/O Cell ........................................................................................................................................................................ 16 6. Global OE Generation ................................................................................................................................................. 17 7. Zero Power/Low Power and Power Management ...................................................................................................... 18 8. IEEE 1149.1-Compliant Boundary Scan Testability ..................................................................................................... 19 9. I/O Quick Configuration .............................................................................................................................................. 20 10. IEEE 1532-Compliant In-System Programming ....................................................................................................... 21 11. User Electronic Signature ........................................................................................................................................ 22 12. Security Bit .............................................................................................................................................................. 23 13. Hot Socketing .......................................................................................................................................................... 24 14. Density Migration ................................................................................................................................................... 25 15. AEC-Q100 Tested and Qualified .............................................................................................................................. 26 1, 2, 3 16. Absolute Maximum Ratings .............................................................................................................................. 27 17. Recommended Operating Conditions..................................................................................................................... 28 18. Erase Reprogram Specifications.............................................................................................................................. 29 1, 2, 3 19. Hot Socketing Characteristics ........................................................................................................................... 30 20. I/O Recommended Operating Conditions .............................................................................................................. 31 21. DC Electrical Characteristics.................................................................................................................................... 32 22. Supply Current, LA-ispMACH 4000V ........................................................................................................................ 33 23. Supply Current, LA-ispMACH 4000Z ........................................................................................................................ 34 24. I/O DC Electrical Characteristics ............................................................................................................................. 35 25. LA-ispMACH 4000V/Z External Switching Characteristics ...................................................................................... 36 26. Timing Model .......................................................................................................................................................... 37 27. LA-ispMACH 4000V/Z Internal Timing Parameters ................................................................................................. 38 28. LA-ispMACH 4000V/Z Timing Adders...................................................................................................................... 40 29. Boundary Scan Waveforms and Timing Specifications ........................................................................................... 41 30. Power Consumption ............................................................................................................................................... 42 31. Power Estimation Coefficients* .............................................................................................................................. 43 32. Switching Test Conditions ....................................................................................................................................... 44 33. Signal Descriptions .................................................................................................................................................. 45 34. LA-ispMACH 4000V ORP Reference Table ................................................................................................................ 46 35. LA-ispMACH 4000Z ORP Reference Table ................................................................................................................ 47 1 36. LA-ispMACH 4000V/Z Power Supply and NC Connections .................................................................................... 48 2014-2017 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02021-2.6

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LA4
LAT
LATTICE SEMI
Lattice Semiconductor
Lattice Semiconductor Corporation
Vantis

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