LCMXO3L-4300E-6MG256C Lattice

LCMXO3L-4300E-6MG256C electronic component of Lattice
LCMXO3L-4300E-6MG256C Lattice
LCMXO3L-4300E-6MG256C FPGA - Field Programmable Gate Array
LCMXO3L-4300E-6MG256C  Semiconductors
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X-On Electronics has gained recognition as a prominent supplier of LCMXO3L-4300E-6MG256C FPGA - Field Programmable Gate Array across the USA, India, Europe, Australia, and various other global locations. LCMXO3L-4300E-6MG256C FPGA - Field Programmable Gate Array are a product manufactured by Lattice. We provide cost-effective solutions for FPGA - Field Programmable Gate Array, ensuring timely deliveries around the world.

Part No. LCMXO3L-4300E-6MG256C
Manufacturer: Lattice
Category: FPGA - Field Programmable Gate Array
Description: FPGA - Field Programmable Gate Array MachXO3; 4320 LUTs; 1.2V
Datasheet: LCMXO3L-4300E-6MG256C Datasheet (PDF)
Price (USD)
260: USD 12.3984 ea
Line Total: USD 3223.58 
Availability : 0
  
QtyUnit Price
260$ 12.3984
1040$ 12.3984

Availability 0
Ship by Thu. 16 Oct to Mon. 20 Oct
MOQ : 260
Multiples : 260
QtyUnit Price
260$ 12.3984
1040$ 12.3984

   
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We are delighted to provide the LCMXO3L-4300E-6MG256C from our FPGA - Field Programmable Gate Array category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LCMXO3L-4300E-6MG256C and other electronic components in the FPGA - Field Programmable Gate Array category and beyond.

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MachXO3 Family Data Sheet FPGA-DS-02032-2.3 November 2018 MachXO3 Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 6 1. Introduction .................................................................................................................................................................. 7 1.1. Features ............................................................................................................................................................... 8 1.1.1. Solutions ......................................................................................................................................................... 8 1.1.2. Flexible Architecture ....................................................................................................................................... 8 1.1.3. Advanced Packaging ....................................................................................................................................... 8 1.1.4. Pre-Engineered Source Synchronous I/O ........................................................................................................ 8 1.1.5. High Performance, Flexible I/O Buffer ............................................................................................................ 8 1.1.6. Flexible On-Chip Clocking ................................................................................................................................ 8 1.1.7. Non-volatile, Multi-time Programmable ......................................................................................................... 8 1.1.8. TransFR Reconfiguration ................................................................................................................................. 8 1.1.9. Enhanced System Level Support ..................................................................................................................... 8 1.1.10. Applications ................................................................................................................................................ 8 1.1.11. Low Cost Migration Path ............................................................................................................................ 8 2. Architecture ................................................................................................................................................................ 10 2.1. Architecture Overview ...................................................................................................................................... 10 2.2. PFU Blocks ......................................................................................................................................................... 12 2.2.1. Slices ............................................................................................................................................................. 12 2.2.2. Modes of Operation ...................................................................................................................................... 14 2.2.3. RAM Mode .................................................................................................................................................... 14 2.2.4. ROM Mode .................................................................................................................................................... 14 2.3. Routing .............................................................................................................................................................. 15 2.4. Clock/Control Distribution Network................................................................................................................... 15 2.4.1. sysCLOCK Phase Locked Loops (PLLs) ........................................................................................................... 17 2.5. sysMEM Embedded Block RAM Memory .......................................................................................................... 20 2.5.1. sysMEM Memory Block ................................................................................................................................ 20 2.5.2. Bus Size Matching ......................................................................................................................................... 20 2.5.3. RAM Initialization and ROM Operation ........................................................................................................ 20 2.5.4. Memory Cascading ....................................................................................................................................... 20 2.5.5. Single, Dual, Pseudo-Dual Port and FIFO Modes .......................................................................................... 21 2.5.6. FIFO Configuration ........................................................................................................................................ 22 2.5.7. Memory Core Reset ...................................................................................................................................... 22 2.5.8. EBR Asynchronous Reset .............................................................................................................................. 23 2.6. Programmable I/O Cells (PIC) ............................................................................................................................ 24 2.7. PIO ..................................................................................................................................................................... 26 2.7.1. Input Register Block ...................................................................................................................................... 26 2.7.2. Output Register Block ................................................................................................................................... 26 2.7.3. Tri-state Register Block ................................................................................................................................. 27 2.8. Input Gearbox ................................................................................................................................................... 27 2.9. Output Gearbox ................................................................................................................................................. 29 2.10. sysI/O Buffer ...................................................................................................................................................... 31 2.10.1. Typical I/O Behavior during Power-up ..................................................................................................... 31 2.10.2. Supported Standards ................................................................................................................................ 31 2.10.3. sysI/O Buffer Banks ................................................................................................................................... 33 2.11. Hot Socketing .................................................................................................................................................... 34 2.12. On-chip Oscillator .............................................................................................................................................. 34 2.13. Embedded Hardened IP Functions .................................................................................................................... 35 2 2.13.1. Hardened I C IP Core ................................................................................................................................ 35 2.13.2. Hardened SPI IP Core ................................................................................................................................ 36 2.13.3. Hardened Timer/Counter ......................................................................................................................... 38 2.14. User Flash Memory (UFM) ................................................................................................................................ 39 2.15. Standby Mode and Power Saving Options ........................................................................................................ 39 2014-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02032-2.3

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LAT
LATTICE SEMI
Lattice Semiconductor
Lattice Semiconductor Corporation
Vantis
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