MDNA700P2200CC Littelfuse

MDNA700P2200CC electronic component of Littelfuse
MDNA700P2200CC Littelfuse
MDNA700P2200CC Discrete Semiconductor Modules
MDNA700P2200CC  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of MDNA700P2200CC Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. MDNA700P2200CC Discrete Semiconductor Modules are a product manufactured by Littelfuse. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

Part No. MDNA700P2200CC
Manufacturer: Littelfuse
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules BIPOLAR MODULE
Datasheet: MDNA700P2200CC Datasheet (PDF)
Price (USD)
1: USD 257.378 ea
Line Total: USD 257.38 
Availability : 11
  
Ship by Tue. 11 Nov to Thu. 13 Nov
QtyUnit Price
1$ 257.378
12$ 253.022
102$ 243.265
1002$ 243.254
10002$ 243.232

Availability 11
Ship by Tue. 11 Nov to Thu. 13 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 257.378
12$ 253.022
102$ 243.265
1002$ 243.254
10002$ 243.232

   
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We are delighted to provide the MDNA700P2200CC from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MDNA700P2200CC and other electronic components in the Discrete Semiconductor Modules category and beyond.

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MDNA700P2200CC V = 2x2200 V RRM High Voltage Standard Rectifier Module I = 700 A FAV V = 1.05 V F Phase leg Part number MDNA700P2200CC Backside: isolated 2 1 3 Features / Advantages: Applications: Package: ComPack Package with DCB ceramic Diode for main rectification Isolation Voltage: V~ 4800 Improved temperature and power cycling For single and three phase Industry standard outline Planar passivated chips bridge configurations RoHS compliant Very low forward voltage drop Supplies for DC power equipment Base plate: Copper Very low leakage current Input rectifiers for PWM inverter internally DCB isolated Battery DC power supplies Advanced power cycling Field supply for DC motors Phase Change Material available Disclaimer Notice Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20190607a 2019 IXYS all rights reservedMDNA700P2200CC Ratings Rectifier Symbol Definition Conditions min. typ. max. Unit T = 25C 2300 V V max. non-repetitive reverse blocking voltage RSM VJ T = 25C 2200 V V max. repetitive reverse blocking voltage RRM VJ reverse current I V = 2 2 0 0 V T = 25C 500 A R VJ R V = 2 2 0 0 V T = 1 5 0 C 20 mA R VJ forward voltage drop V I = 7 0 0 A T = 25C 1.14 V F F VJ I = 1 4 0 0 A 1.35 V F T = C 1.05 V I = 7 0 0 A 125 F VJ I = 1 4 0 0 A 1.30 V F average forward current T = 1 0 0 C T = 1 5 0 C 700 A I FAV C VJ rectangular d = 0.5 V T = 1 5 0 C 0.78 V threshold voltage F0 VJ for power loss calculation only slope resistance r 0.35 m F thermal resistance junction to case 0.055 K/W R thJC thermal resistance case to heatsink K/W R 0.02 thCH P total power dissipation T = 25C 2270 W tot C max. forward surge current t = 10 ms (50 Hz), sine T = 45C 20.0 kA I FSM VJ t = 8,3 ms (60 Hz), sine V = 0 V 21.6 kA R t = 10 ms (50 Hz), sine T = 1 5 0 C kA 17.0 VJ t = 8,3 ms (60 Hz), sine V = 0 V 18.4 kA R value for fusing It t = 10 ms (50 Hz), sine T = 45C 2.00 MAs VJ t = 8,3 ms (60 Hz), sine V = 0 V 1.94 MAs R t = 10 ms (50 Hz), sine T = 1 5 0 C 1.45 MAs VJ t = 8,3 ms (60 Hz), sine V = 0 V 1.40 MAs R V = 4 0 0 V f = 1 MHz T = 25C 781 pF C junction capacitance J R VJ IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20190607a 2019 IXYS all rights reserved

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