MA4P7435NM-1091T Non Magnetic MELF PIN Diode Rev. V4 Solderable Surfaces Features Non-Magnetic Package Suitable for MRI Applications Cathode Rectangular MELF SMQ Ceramic Package Low R for Low Series Loss s Longer for Low Inter-Modulation Distortion L Full Face High Average Incident Power Handling Chip Bond RoHS Compliant Passivated PIN Chip Description and Applications The MA4P7435NM-1091T is a surface mountable PIN diode in a non-magnetic, Metal Electrode Diode Cross Section Leadless Faced (MELF) package. The device incorporates M/A-COM Technologys proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM Technologys new Designed for Automated Assembly non-magnetic plating process to provide an These SMQ PIN diodes are designed for high extremely low magnetic permeability, hermetically volume tape and reel assembly. The rectangular sealed package. Incorporated in the package is a package design provides for ease of use in most glass passivated PIN chip that is full face bonded automatic pick and place assembly operations. The on both the cathode and anode to maximize parallel flat surfaces are suitable for key jaw or surface area for lower series and thermal vacuum pickup techniques. All solder able surfaces resistance. The MA4P7435NM-1091T has been are tin plated and compatible with reflow and vapor comprehensively characterized both electrically phase soldering methods. and mechanically to ensure repeatable and predictable performance. The diode is well suited for use in low loss, low distortion, high power 1 Absolute Maximum Ratings 25C switching circuits and is especially designed for use in high magnetic field environments from HF Parameter Absolute Maximum through UHF frequencies. The low thermal resistance of this device also provides excellent Operating Temperature -65C to +125C performance at high incident RF power levels. This Storage Temperature -65C to +150C device has been designed to perform well in the Diode Junction Temperature +175C Continuous most rigorous electrical and mechanical MRI environments. Diode Mounting Temperature +265C for 10 seconds RF C.W. Incident Power + 60 dBm C.W. Forward D.C. Current +500mA Reverse D.C. Voltage -10 A -1100V 1. Exceeding these limits may cause permanent damage. 11 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MA4P7435NM-1091T Non Magnetic MELF PIN Diode Rev. V4 Electrical Specifications T = +25C AMB Test Parameters Symbol Units Conditions Min. Typ. Max. 1 Total Capacitance C pF 1MHz / 100V - - 3.0 T 2,3 Series Resistance R 63.6MHz / 100mA - - 0.30 S 2,3 Series Resistance R 63.6MHz / 200mA - - 0.25 S 2,3 Series Resistance R 63.6MHz / 300mA - - 0.20 S Parallel Resistance R 63.6MHz / 0V 4K - - p Forward Voltage V V +100mA .9 1.0 F Reverse Current I nA -1100 - - 50 R 4 Carrier Lifetime T S I /I 10 14 - L F 10mA R 6mA Thermal Resistance C/W - - 3 5 1. Total capacitance is equivalent to the sum of the chip junction capacitance Cj plus package parasitic capacitance . 2. Series resistance R is the sum of the chip to package contact resistance plus junction resistance Rj. S 3. Rs is measured on an HP4291A . 4. Measured from 50% of control voltage to 90% of output voltage Environmental Capability MELF devices are applicable for use in commercial and military applications and are designed to meet the environmental requirements of MIL-STD-750, MIL-STD-202 as well as other military standards. The table below lists some of the typical MIL-STD 750 tests the devices are designed to meet . MIL-STD-750 Test Method Description High Temperature Storage 1031 +150C, for 340 Hours Temperature Shock 1051 -65C to +125C, 20 Cycles HTRB 1038 880V, +150C, for 96 Hours Moisture Resistance 1021 No Initial Conditioning, 85% RH, +85C Gross Leak 1071 Cond. E Dye Penetrant Visual Vibration Fatigue 2046 20,000Gs, 60 Hz, x, y, z axis Solderability 2026 Test Temperature = +245C 22 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: