MADS-001317-1500AG

MADS-001317-1500 Solderable GaAs Flip Chip Schottky Diode Rev. V5 Features Usable Past 80 GHz Low Series Resistance Low Capacitance High Cutoff Frequency Silicon Nitride Passivation Polyimide Scratch Protection MADS-001317 1500 Lead Free (RoHS Compliant) Designed for Easy Circuit Insertion Available in Pocket Tape and Reel Can be Mounted with Solder or Conductive Epoxy Description and Applications Ordering Information The MADS-001317-1500 single is a gallium arsenide flip chip Schottky barrier diode. This device Part Number Package is fabricated on OMCVD epitaxial material using a process designed for high device uniformity and MADS-001317-1500AG 100 piece gel pack extremely low parasitics. This diode is fully passivated with silicon nitride and has an additional MADS-001317-1500AP 3000 piece reel layer of polyimide for scratch protection. The protective coating prevents damage to the junction during automated or manual handling. The flip chip configuration is suitable for pick and place insertion. This device with can be attached with solder or conductive epoxy. The high cutoff frequency of this diode allows use through millimeter wave frequencies. Typical applications include single and double balanced mixers in PCN transceivers and radios, police radar detectors, and automotive radar detectors. Electrical Specifications + 25 C Parameters Test Conditions Units Min. Typ. Max. Junction Capacitance (C ) 0 V, 1 MHz pF 0.020 J 1 Total Capacitance (C ) 0 V, 1 MHz pF 0.030 0.045 0.060 T Dynamic Resistance (R ) 9.5 - 10.5 mA Ohms 4 7 S Forward Voltage (V 1) 1 mA Volts 0.60 0.70 0.80 F Reverse Breakdown Voltage (V ) -10 A Volts 4.5 7 BR 1. Total capacitance is equivalent to the sum of junction capacitance C and parasitic capacitance C . J P 11 1 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MADS-001317-1500 Solderable GaAs Flip Chip Schottky Diode Rev. V5 2 Absolute Maximum Ratings Forward Current vs. Temperature Parameter Absolute Maximum 100.00 +25C +125C Incident LO Power +20 dBm 10.00 - 50C Incident RF Power +20 dBm 1.00 Operating Temperature -65C to +125C 0.10 Storage Temperature -65C to +150C 0.01 Electrostatic Discharge Class 0, HBM Classification 0.00 2. Operation of this device above any one of these parameters 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 may cause permanent damage. Forward Voltage (V) Handling Procedures Mounting Techniques The following precautions should be observed to Die attach for these devices is made simple through avoid damaging these chips: the use of surface mount die attach technology. This chip was designed to be inserted onto hard or soft Cleanliness: The chips should be handled in a substrates with the junction side down. This chip can clean environment. Do not attempt to clean die after be mounted with conductive epoxy or with solder. installation. Solder Die Attach: Static Sensitivity: Schottky barrier diodes are ESD This device can be mounted with Sn63/Pb37 or sensitive and can be damaged by static RoHS compliant solder. electricity. Proper ESD techniques should be used Typical reflow profiles are provided on MACOM ap- when handling these devices. plication note M538 Surface Mounting In- structions which can be found on the MACOM web- General Handling: The protective polymer coating site. on the active areas of these die provides scratch protection, particularly for the metal air bridge which contacts the anode. Die can be handled with Epoxy Die Attach: tweezers or vacuum pickups and are suitable for use This device can also be attached with conductive with automatic pick-and-place equipment. epoxy. The assembly can be preheated to 125 - 150C. Use a minimum amount of epoxy. Cure epoxy as per manufacturers instructions. 22 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: