MLX91802KXZ-DBU-000-SP Melexis

MLX91801/2 Tire Pressure Monitoring SiP Features and Benefits Application Examples
Low-Power Microcontroller-based Pressure-
Continuous car and truck Tire Pressure Temperature-Battery monitor, ideally suited for Monitoring System (TPMS) TPMS
Low-Power Wireless Pressure-
Ready to use Melexis firmware (MLX91802) or Temperature-Battery sensor customers firmware (MLX91801)
Different available pressure ranges up to 1400 kPa
Measurement of car and truck tire pressure with typical precision 1% of Full Scale range
Sleep current 0.25 A
Run mode current 340 A
Temperature compensation of pressure sensor and oscillator
Diagnostics for system error detection
Motion detection with external shock sensor
Robust package
Shock survival up to 4000 G
7 GPIO pins (digital IN/OUT, analog IN)
Compatible with existing Remote Keyless Entry (RKE) systems
Very sensitive LF interface for short-range wireless communication using 125KHz
Automotive qualified Ordering Information Order code Temperature Range Package Program memory Delivery MLX91801KXZ-EAF-000-TU (*) -40C to 125C SO16-wide FLASH Tube MLX91801KXZ-EAF-000-RE (*) -40C to 125C SO16-wide FLASH Reel MLX91801KXZ-xxx-000-RE (**) -40C to 125C SO16-wide ROM Reel MLX91802KXZ-DBU-000-TU -40C to 125C SO16-wide ROM Tube MLX91802KXZ-DBU-000-RE -40C to 125C SO16-wide ROM Reel (*) parts with FLASH program memory are to be used for software development (**) dedicated ROM code xxx is assigned after customer ROM order General Description Functional diagram The MLX91801/2 is a System in a Package (SIP) SO16 package combining an analog pressure sensor and a low-power Pressure sensor sensor interface with an MLX16 micro-controller in a custom, pressure ported, plastic SO16 package. Its primary use is in wireless TPMS applications. Using a Motion sensor interface suitable RF transmitter, the system can be made Battery voltage compliant with existing Remote Keyless Entry (RKE) sensor systems. Temperature Typical power consumption in standby mode is less than sensor ADC 0.25 A up to 25C ambient temperature. RF The MLX91801/2 accepts input from an external, shock Tx MCU or roll sensor enabling intelligent power management to Serial Serial maximize battery life. coder encoder The MLX91801/2 offers 1% Full Scale accuracy. The LF Receiver default pressure range is 100 800 kPa for MLX91801 and 100-1400 kPa for MLX91802. Other ranges are available on request. 3901091801 Page 1 of 21 Rev 007 05/13 MLX91801/2 Tire Pressure Monitoring SiP Table of Contents General Description....................................................................................................................................................... 1 Functional diagram ........................................................................................................................................................ 1 1. Glossary of Terms ..................................................................................................................................................... 3 2. Absolute Maximum Ratings ....................................................................................................................................... 4 3. Pin Definitions and Descriptions ................................................................................................................................ 5 4. General Electrical Specifications ............................................................................................................................... 6 4.1 General Power Specification................................................................................................................................ 6 4.2 Measurement Power Consumption...................................................................................................................... 7 4.3 Digital Input/Output characteristics of IO1IO7 .................................................................................................. 8 5. Oscillators Specifications........................................................................................................................................... 8 6. Sensor Specific Specifications................................................................................................................................... 9 7. LFR Specifications................................................................................................................................................... 10 8. Detailed General Description................................................................................................................................... 11 8.1 MLX16 core ....................................................................................................................................................... 12 8.2 Oscillators.......................................................................................................................................................... 12 8.3 Timers................................................................................................................................................................ 13 8.4 Memory.............................................................................................................................................................. 13 8.4.1 Program memory (ROM/FLASH)................................................................................................................ 13 8.4.2 EEPROM .................................................................................................................................................... 13 8.4.3 RAM............................................................................................................................................................ 13 8.4.4 Software Patch ........................................................................................................................................... 14 8.5 Measurement Functions .................................................................................................................................... 14 8.5.1 Absolute Pressure sensor........................................................................................................................... 14 8.5.2 Temperature sensor ................................................................................................................................... 14 8.5.3 Battery voltage sensor ................................................................................................................................ 15 8.6 Motion Detection Sensing.................................................................................................................................. 15 8.7 Amplifier and ADC ............................................................................................................................................. 15 8.8 Communication.................................................................................................................................................. 15 9. Application Information ............................................................................................................................................ 17 9.1 Typical application diagram ............................................................................................................................... 17 9.2 Programming and debug interface..................................................................................................................... 18 9.3 MLX91801/2 Demonstration Kit......................................................................................................................... 18 10. Standard information regarding manufacturability of Melexis products with different soldering processes............ 19 11. ESD Precautions ................................................................................................................................................... 20 12. Package Information.............................................................................................................................................. 20 12.1 Package outline ............................................................................................................................................... 20 13. Disclaimer.............................................................................................................................................................. 21 3901091801 Page 2 of 21 Rev 007 05/13