4900P-25G

4900P SAC305 Solder PasteNo-Clean 4900P is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces. 4900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm. Properties Features & Benefits Alloy exceeds J-STD-006C and meets ASTM Flux Classification ROL0 B 32 purity requirements Flux Type Rosin Flux meets J-STD-004B Flux Activity Low Repeatable and consistent printing Copper Mirror No removal characteristics Corrosion Test Pass Long stencil and tack life facilitate high speed Electromigration Pass printing Excellent wettability Solder Ball Test Pass Suitable for air or nitrogen atmospheres Slump Test Medium-soft, non-cracking residues 25 C, 0.63 vert./horiz. No bridges 150 C, 0.63 vert./horiz. No bridges 25 C, 0.33 vert./horiz. No bridges Available Packaging 150 C, 0.33 vert./horiz. Pass Cat. No. Packaging Net Vol. Net Wt. Viscosity, poise 16 0 01900 4900P-25G Syringe 0.88 mL 25 g Acid Number (mgKOH/g sample) 117 4900P-250G Jar 8.81 mL 250 g Halides (by weight) <0.05 % Post Reflow Flux Residue 5.5 % Metal Loading 88.5 % Contact Information 10 Surface Insulation Resistance (SIR) 2.0 x 10 MG Chemicals, 1210 Corporate Drive 10 Burlington, Ontario, Canada L7L 5R6 Bellcore (Telecordia) 5.3 x 10 Email: support mgchemicals.com Tack Initial 124 g Phone: Nor th America: +(1)80 0 -3 40 - 0772 Retention 24 h 111 g International: +(1) 905-331-1396 Europe: +(44)1663 362888 Retention 72 h 98 g ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 23 July 2021 / Ver. 3.0 14900P Application Instructions Storage and Handling Read the product SDS before using this product Store refrigerated between 210 C in an upright (downloadable at www.mgchemicals.com). position with tip down to prevent flux separation and air entrapment. 1. Take solder paste out of refrigerator and allow it to reach room temperature prior use. Unopened Container 2. For syringe: Remove the cap from the syringe. Do not discard cap. Shelf Life 210 C 1 year a. Insert plunger to the back of the syringe. For Shelf Life 2025 C 6 months better control, insert needle to the tip. b. Dispense paste onto the desired area and place component on top. 3. For jar: Apply paste using a wooden stick to the desired area and place component on top. 4. Apply heat using a heat gun. 5. Clean tip to prevent contamination and material buildup. 6. Replace the cap on the syringe. 7. (Optional) Clean residue with MG 8241-T or 8241-W Isopropyl Alcohol Wipes. Reflow Best results have been achieved when the paste is reflowed in a forced air convection oven with a minimum of 8 zones. The following is a recommended profile for a forced air convection reflow process. Preheat ZoneIt is the ramp zone, which elevates the temperature of the PCB to the desired soak temperature. The rate of temperature rise should not exceed 2.5 C/s to avoid thermal shock stress. Soak ZoneIt exposes the PCB to a stable temperature that allows the components to reach a uniform temperature. It allows the flux to concentrate and the volatiles to escape from the paste. Reflow Zone It is the spike zone, which elevates the temperature of the PCB assembly from the activation temperature to the recommended peak temperature. 250 200 Preheat Disclaimer 150 This information is believed to be accurate. It is Reflow 100 intended for professional end-users who have the Soak skills required to evaluate and use the data properly. 50 M.G. Chemicals Ltd. does not guarantee the accuracy of the data and assumes no liability in connection with 0 0 30 60 90 120 150 180 210 240 270 300 330 360 damages incurred while using it. Time (seconds) ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 23 July 2021 / Ver. 3.0 2 Temperture (C)