832B Technical Data Sheet Black Epoxy, Encapsulating & Potting Compound Description 832B potting and encapsulating compound is a black, general purpose, hard, two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Due to its low mixed viscosity, 832B can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals. This epoxy has a convenient 2:1 volume mix ratio, making it compatible with most dispensing equipment. 832B can be cured at room temperature or higher. Features and Benefits Convenient 2A:1B volume mix ratio Low mixed viscosity of 3 300 cP Extremely high compressive and tensile strength Excellent adhesion to a wide variety of substrates including metals, composites, glass, ceramics, and many plastics Excellent electrical insulating characteristics Broad service temperature range -40 to 140 C (-40 to 284 F) Extreme resistance to water and humidity (allows for submersion where needed) Solvent-free ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 D a t e : 0 7 M a y 2 0 19 / V e r. 3 . 0 2 Page 1832B Usage Parameters Properties Value Working life 22 C 72 F 1 h Shelf life 5 y Full cure 22 C 72 F 24 h Full cure 65 C 149 F 1 h Full cure 80 C 176 F 30 min Full cure 100 C 212 F 20 min Temperature Ranges Properties Value Constant service temperature -40 to 140 C -40 to 284 F a) Maximum intermittent temperature 175 C 347 F Storage temperature of unmixed parts 16 to 27 C 61 to 81 F a) Temperature that can be withstood for short periods without sustaining damage. ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 Date: 07 May 2019 / Ver. 3.02 Page 2