Product Information

1N6109AUS

1N6109AUS electronic component of Microchip

Datasheet
Diode TVS Single Bi-Dir 9.9V 500W 2-Pin E-MELF

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

100: USD 10.2375 ea
Line Total: USD 1023.75

0 - Global Stock
MOQ: 100  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

1N6109AUS
Microchip

1 : USD 25.4067
10 : USD 23.2401
25 : USD 22.2986
50 : USD 21.9633
100 : USD 20.8799
250 : USD 20.5575
500 : USD 20.248

0 - WHS 2


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 50
Multiples : 1

Stock Image

1N6109AUS
Microchip

50 : USD 14.6143
500 : USD 14.0195
5000 : USD 13.7391

0 - WHS 3


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

1N6109AUS
Microchip

1 : USD 19.436
4 : USD 18.0477
15 : USD 17.3536
40 : USD 16.6594
100 : USD 16.6594

0 - WHS 4


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 100
Multiples : 1

Stock Image

1N6109AUS
Microchip

100 : USD 10.2375

0 - WHS 5


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

1N6109AUS
Microchip

1 : USD 26.0563
10 : USD 22.2218

     
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1N6103AUS 1N6137AUS Qualified Levels: Voidless Hermetically Sealed Surface Mount JAN, JANTX, JANTXV Available on Bidirectional Transient Voltage Suppressors and JANS* commercial Qualified to MIL-PRF-19500/516 versions DESCRIPTION This surface mount series of industry recognized voidless, hermetically sealed, bidirectional Transient Voltage Suppressors (TVS) designs is military qualified to MIL-PRF-19500/516 and is ideal for high-reliability applications where a failure cannot be tolerated. They provide a Working Peak Standoff Voltage selection from 5.7 to 152 Volts with a 500 W rating for a 10/1000 s pulse. They are very robust in hard-glass construction and internal Category 1 metallurgical bonds. These are also available as both a non-suffix part and an A version providing different voltage tolerances as described in the nomenclature section. These devices are also available in axial- B or SQ-MELF leaded packages for thru-hole mounting. Package Also available in: Important: For the latest information, visit our website 1N6103AUS 1N6137AUS MECHANICAL and PACKAGING CASE: Hermetically sealed voidless hard glass with tungsten slugs. TERMINALS: Tin/lead plate over copper. RoHS compliant matte-tin is available on commercial grade only. MARKING: None. POLARITY: No polarity marking for these bidirectional TVSs. TAPE & REEL option: Standard per EIA-481-B. Consult factory for quantities. WEIGHT: Approximately 539 milligrams. See Package Dimensions on last page. PART NOMENCLATURE Applicable to entire series: JAN 1N6103 A US (e3) Reliability Level RoHS Compliance JAN = JAN Level e3 = RoHS compliant (available on commercial grade only) JANTX = JANTX Level JANTXV = JANTXV Level Blank = non-RoHS compliant Blank = commercial Surface Mount Package JEDEC type number See Electrical Characteristics Voltage Tolerance table A = Standard Blank =5% higher V , 5% lower C min. V and 5% lower I (BR) PP Applicable to 1N6103(A)US 1N6118(A)US only: JANS 1N6103 A US Reliability Level Surface Mount Package JANS = JANS Level Voltage Tolerance JEDEC type number A = Standard See Electrical Characteristics Blank =5% higher V , 5% lower C table min. V and 5% lower I (BR) PP Applicable to 1N6119(A)US 1N6137(A)US only: MSP 1N6119 A US (e3) Reliability Level RoHS Compliance MSP (reference JANS) e3 = RoHS compliant Blank = non-RoHS compliant JEDEC type number See Electrical Characteristics Surface Mount Package table Voltage Tolerance A = Standard Blank =5% higher V , 5% lower C min. V and 5% lower I (BR) PP T4-LDS-0277-1, Rev. 1 (121354) 2013 Microsemi Corporation Page 2 of 6

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS
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