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24AA64-I/SM

24AA64-I/SM electronic component of Microchip

Datasheet
Memory; EEPROM; I2C; 8kx8bit; 1.7÷5.5V; 400kHz; SO8

Manufacturer: Microchip
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Price (USD)

1: USD 0.5773 ea
Line Total: USD 0.58

680 - Global Stock
Ships to you between
Thu. 09 May to Mon. 13 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
680 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1

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24AA64-I/SM
Microchip

1 : USD 0.5773
25 : USD 0.5669
90 : USD 0.5531

     
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24AA64/24LC64/24FC64 2 64K I C Serial EEPROM Pb-Free and RoHS Compliant Device Selection Table Temperature Ranges: Part VCC Max. Clock Temp. - Industrial (I): -40C to +85C Number Range Frequency Ranges - Automotive (E): -40C to +125C (1) 24AA64 1.7-5.5 400 kHz I, E Description: 24LC64 2.5-5.5 400 kHz I, E (2) The Microchip Technology Inc. 24AA64/24LC64/ 24FC64 1.7-5.5 1 MHz I 24FC64 (24XX64*) is a 64 Kbit Electrically Erasable Note 1: 100 kHz for VCC <2.5V. PROM. The device is organized as a single block of 2: 400 kHz for VCC <2.5V. 8K x 8-bit memory with a 2-wire serial interface. Low- voltage design permits operation down to 1.7V, with Features: standby and active currents of only 1 A and 3 mA, respectively. It has been developed for advanced, low- Single-Supply with Operation down to 1.7V for power applications such as personal communications 24AA64/24FC64 Devices, 2.5V for 24LC64 or data acquisition. The 24XX64 also has a page write Devices capability for up to 32 bytes of data. Functional Low-Power CMOS Technology: address lines allow up to eight devices on the same - Active current 3 mA, max. bus, for up to 512 Kbits address space. The 24XX64 is - Standby current 1 A, max. available in the standard 8-pin PDIP, surface mount 2 SOIC, SOIJ, TSSOP, DFN, TDFN and MSOP 2-Wire Serial Interface, I C Compatible packages. The 24XX64 is also available in the 5-lead Packages with 3 Address Pins are Cascadable up SOT-23, and Chip Scale packages. to 8 Devices Block Diagram Schmitt Trigger Inputs for Noise Suppression Output Slope Control to Eliminate Ground Bounce HV A0 A1 A2WP Generator 100 kHz and 400 kHz Clock Compatibility 1 MHz Clock for FC versions Page Write Time 5 ms, max. I/O Memory EEPROM Self-timed Erase/Write Cycle Control Control XDEC Array Logic Logic 32-Byte Page Write Buffer Page Hardware Write-Protect Latches ESD Protection > 4,000V I/O SCL More than 1 Million Erase/Write Cycles YDEC Data Retention > 200 Years SDA Factory Programming Available Packages include 8-lead PDIP, SOIC, SOIJ, VCC Sense Amp. TSSOP, X-Rotated TSSOP, MSOP, DFN, TDFN, VSS 5-lead SOT-23 or Chip Scale R/W Control Package Types (1) PDIP/MSOP/SOIC/SOIJ/TSSOP DFN/TDFN CS (Chip Scale) SOT-23 X-Rotated TSSOP SCL 1 5 WP A0 1 VCC 8 A0 1 8 VCC (X/ST) VCC VSS 1 2 7 WP A1 2 A1 2 7 WP WP 3 VSS 2 1 8 WP SCL 6 SCL A2 3 2 7 SCL 45 SDA VCC SDA A2 3 6 SCL 3 6 VSS A0 VSS 4 5 SDA VCC 34 SDA 5 4 VSS 4 5 SDA A1 A2 (Top Down View, Balls Not Visible) Note 1: Available in I-temp, AA only. * 24XX64 is used in this document as a generic part number for the 24AA64/24LC64/24FC64 devices. 1997-2012 Microchip Technology Inc. DS21189T-page 124AA64/24LC64/24FC64 1.0 ELECTRICAL CHARACTERISTICS () Absolute Maximum Ratings VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature with power applied................................................................................................-40C to +125C ESD protection on all pins 4kV NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40C to +85C, VCC = +1.7V to +5.5V DC CHARACTERISTICS Automotive (E): TA = -40C to +125C, VCC = +1.7V to +5.5V Param. Sym. Characteristic Min. Typ. Max. Units Conditions No. A0, A1, A2, WP, SCL and SDA pins D1 VIH High-level input voltage 0.7 VCC V D2 VIL Low-level input voltage 0.3 VCC V VCC 2.5V 0.2 VCC V VCC 2.5V D3 VHYS Hysteresis of Schmitt 0.05 VCC V VCC 2.5V (Note 1) Trigger inputs (SDA, SCL pins) D4 VOL Low-level output voltage 0.40 V IOL = 3.0 mA VCC = 4.5V IOL = 2.1 mA VCC = 2.5V D5 ILI Input leakage current 1 AVIN = VSS or VCC, WP = VSS VIN = VSS or VCC, WP = VCC D6 ILO Output leakage current 1 AVOUT = VSS or VCC D7 CIN, Pin capacitance 10 pFVCC = 5.0V (Note 1) COUT (all inputs/outputs) TA = 25C, FCLK = 1 MHz D8 ICC write Operating current 0.1 3 mAVCC = 5.5V, SCL = 400 kHz D9 ICC read 0.05 400 A D10 ICCS Standby current 0.01 1 A Industrial 5 A Automotive SDA = SCL = VCC A0, A1, A2, WP = VSS Note 1: This parameter is periodically sampled and not 100% tested. 2: Typical measurements taken at room temperature. DS21189T-page 2 1997-2012 Microchip Technology Inc.

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
AT9
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi

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