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24LC256-I/P

24LC256-I/P electronic component of Microchip

Datasheet
24LC256-I/P 256K 32KX8 SER EE

Manufacturer: Microchip
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1: USD 1.2996 ea
Line Total: USD 1.3

0 - Global Stock
Ships to you by
Mon. 29 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
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0 - Global Stock


Ships to you by Mon. 29 Apr

MOQ : 1
Multiples : 1

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24LC256-I/P
Microchip

1 : USD 1.2996
5 : USD 1.1758
25 : USD 0.9283
50 : USD 0.8045
100 : USD 0.7736

     
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24AA256/24LC256/24FC256 2 256K I C CMOS Serial EEPROM Temperature Ranges: Device Selection Table - Industrial (I): -40C to +85 C Part VCC Max. Clock Temp. - Automotive (E): -40C to +125C Number Range Frequency Ranges (1) Description: 24AA256 1.7-5.5V 400 kHz I, E 24LC256 2.5-5.5V 400 kHz I, E The Microchip Technology Inc. 24AA256/24LC256/ (2) 24FC256 (24XX256*) is a 32K x 8 (256 Kbit) Serial 24FC256 1.7-5.5V 1 MHz I Electrically Erasable PROM, capable of operation Note 1: 100 kHz for VCC < 2.5V. across a broad voltage range (1.7V to 5.5V). It has 2: 400 kHz for VCC < 2.5V. been developed for advanced, low-power applications such as personal communications or data acquisition. Features: This device also has a page write capability of up to 64 bytes of data. This device is capable of both random Single Supply with Operation Down to 1.7V for and sequential reads up to the 256K boundary. 24AA256 and 24FC256 Devices, 2.5V for 24LC256 Devices Functional address lines allow up to eight devices on the same bus, for up to 2 Mbit address space. This Low-Power CMOS Technology: device is available in the standard 8-pin plastic DIP, - Read current: 400 uA max. at 5.5V, 400 kHz SOIC, SOIJ, TSSOP, MSOP, DFN and TDFN pack- - Standby current: 1 uA max. at 3.6V, I-temp ages. The 24AA256 is also available in the 8-lead Chip 2 2-Wire Serial Interface, I C Compatible Scale package. Cascadable up to Eight Devices Block Diagram Schmitt Trigger Inputs for Noise Suppression Output Slope Control to Eliminate Ground Bounce A0 A1A2 WP HV Generator 100 kHz and 400 kHz Clock Compatibility Page Write Time 5 ms Max. I/O Self-Timed Erase/Write Cycle Memory EEPROM Control Control XDEC Array 64-Byte Page Write Buffer Logic Logic Hardware Write-Protect Page Latches ESD Protection >4000V I/O More than One Million Erase/Write Cycles SCL YDEC Data Retention >200 years SDA Factory Programming Available Packages Include 8-lead PDIP, SOIC, SOIJ, DFN, VCC TDFN, TSSOP and MSOP VSS Sense Amp. RoHS Compliant R/W Control Package Types (1) PDIP/SOIC/SOIJ (2) TSSOP/MSOP DFN/TDFN CS (Chip Scale) VCC A1 A0 A0 1 8 VCC A0 1 8 VCC 1 8 A0 VCC 12 3 A1 2 7 WP A1 2 7 WP 2 7 A1 WP WP 45 A2 A2 3 6 SCL 6 7 8 A2 3 6 SCL 3 6 A2 SCL SS 4 5 SDA SCL VSS V SDA VSS 4 5 SDA 4 5 VSS SDA (TOP DOWN VIEW, BALLS NOT VISIBLE) Note 1: * Pins A0 and A1 are no connects for the MSOP package only. Note 2: Available in I-temp, AA only. *24XX256 is used in this document as a generic part number for the 24AA256/24LC256/24FC256 devices. 1998-2013 Microchip Technology Inc. DS20001203U-page 1 24XX256 24XX256 24XX25624AA256/24LC256/24FC256 1.0 ELECTRICAL CHARACTERISTICS () Absolute Maximum Ratings VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature with power applied................................................................................................-40C to +125C ESD protection on all pins 4kV NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Electrical Characteristics: DC CHARACTERISTICS Industrial (I): VCC = +1.7V to 5.5V TA = -40C to +85C Automotive (E): VCC = +1.7V to 5.5V TA = -40C to +125C Param. Sym. Characteristic Min. Max. Units Conditions No. A0, A1, A2, SCL, SDA and WP pins: D1 VIH High-level input voltage 0.7 VCC V D2 VIL Low-level input voltage 0.3 VCC V VCC 2.5V 0.2 VCC V VCC < 2.5V D3 VHYS Hysteresis of Schmitt CC VVCC 2.5V (Note) 0.05 V Trigger inputs (SDA, SCL pins) D4 VOL Low-level output voltage 0.40 V IOL = 3.0 mA @ VCC = 4.5V IOL = 2.1 mA @ VCC = 2.5V D5 ILI Input leakage current 1 AVIN = VSS or VCC, WP = VSS VIN = VSS or VCC, WP = VCC D6 ILO Output leakage current 1 AVOUT = VSS or VCC D7 CIN, Pin capacitance 10 pFVCC = 5.0V (Note) COUT (all inputs/outputs) TA = 25C, FCLK = 1 MHz D8 ICC Read Operating current 400 AVCC = 5.5V, SCL = 400 kHz ICC Write 3 mA VCC = 5.5V D9 ICCS Standby current 1.5 ATA = -40C to +85C SCL = SDA = VCC = 5.5V A0, A1, A2, WP = VSS 1 ATA = -40C to +85C SCL = SDA = VCC = 3.6V A0, A1, A2, WP = VSS 5 ATA = -40C to +125C SCL = SDA = VCC = 5.5V A0, A1, A2, WP = VSS Note: This parameter is periodically sampled and not 100% tested. DS20001203U-page 2 1998-2013 Microchip Technology Inc.

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
AT9
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi

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