Product Information

24LC32AT-I/MNY

24LC32AT-I/MNY electronic component of Microchip

Datasheet
EEPROM 32K 4K X 8 2.5V SER EE IND

Manufacturer: Microchip
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Price (USD)

1: USD 1.7778 ea
Line Total: USD 1.78

82 - Global Stock
Ships to you between
Wed. 29 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
57 - WHS 1


Ships to you between
Wed. 29 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

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24LC32AT-I/MNY
Microchip

1 : USD 1.8025
10 : USD 1.5426
30 : USD 1.3997
100 : USD 1.2386
500 : USD 1.1681
1000 : USD 1.1359

     
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Product Category
RoHS - XON
Icon ROHS
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Memory Size
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Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Maximum Clock Frequency
Access Time
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Supply Current - Max
Packaging
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Operating Current
Operating Supply Voltage
Factory Pack Quantity :
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Hts Code
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Product Type
Programming Voltage
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24AA32A/24LC32A 2 32K I C Serial EEPROM Device Selection Table Description: Part VCC Max. Clock Temp. The Microchip Technology Inc. 24AA32A/24LC32A Number Range Frequency Ranges (24XX32A*) is a 32 Kbit Electrically Erasable PROM. The device is organized as a single block of 4K x 8-bit (1) 24AA32A 1.7-5.5 400 kHz I memory with a 2-wire serial interface. Low-voltage 24LC32A 2.5-5.5 400 kHz I, E design permits operation down to 1.7V, with standby Note 1: 100 kHz for VCC <2.5V and active currents of only 1 A and 1mA, respectively. It has been developed for advanced, low- power applications such as personal communications Features: or data acquisition. The 24XX32A also has a page write Single supply with operation down to 1.7V for capability for up to 32 bytes of data. Functional address 24AA32A devices, 2.5V for 24LC32A devices lines allow up to eight devices on the same bus, for up to 256 Kbits address space. The 24XX32A is available Low-power CMOS technology: in the standard 8-pin PDIP, surface mount SOIC, - Active current 1 mA, typical TSSOP, 2x3 DFN and MSOP packages. - Standby current 1 A, typical 2 2-wire serial interface, I C compatible Package Types Cascadable up to eight devices PDIP, MSOP SOIC, TSSOP Schmitt Trigger inputs for noise suppression A0 1 8 VCC Output slope control to eliminate ground bounce A0 1 8 VCC 100 kHz and 400 kHz clock compatibility A1 2 7 WP 2 7 A1 WP Page write time 5 ms max. A2 3 6 SCL 3 6 A2 SCL Self-timed erase/write cycle VSS 4 5 SDA 4 5 VSS SDA 32-byte page write buffer Hardware write-protect DFN ESD protection > 4,000V A0 1 8 VCC More than 1 million erase/write cycles 7 WP A1 2 Data retention > 200 years SCL 6 A2 3 Factory programming available VSS 5 4 SDA Packages include 8-lead PDIP, SOIC, TSSOP, MSOP and DFN Pb-free and RoHS compliant Block Diagram Temperature ranges: WP A0 A1 A2 HV Generator - Industrial (I): -40C to +85C - Automotive (E): -40C to +125C I/O Memory EEPROM Control XDEC Control Array Logic Logic Page Latches I/O SCL YDEC SDA Vcc Sense Amp. VSS *24XX32A is used in this document as a generic part R/W Control number for the 24AA32A/24LC32A devices. 2007 Microchip Technology Inc. DS21713H-page 124AA32A/24LC32A 1.0 ELECTRICAL CHARACTERISTICS () Absolute Maximum Ratings VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ...............................................................................................................................-65C to +150C Ambient temperature with power applied................................................................................................-40C to +125C ESD protection on all pins ...................................................................................................................................................... 4kV NOTICE: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40C to +85C, VCC = +1.7V to +5.5V DC CHARACTERISTICS Automotive (E): TA = -40C to +125C, VCC = +2.5V to +5.5V Param. Symbol Characteristic Min. Typ. Max. Units Conditions No. D1 A0, A1, A2, WP, SCL and SDA pins D2 VIH High-level input voltage 0.7 VCC V D3 VIL Low-level input voltage 0.3 VCC V VCC 2.5V 0.2 VCC V VCC < 2.5V D4 VHYS Hysteresis of Schmitt 0.05 VCC V VCC 2.5V (Note 1) Trigger inputs (SDA, SCL pins) D5 VOL Low-level output voltage 0.40 V IOL = 3.0 mA, VCC = 4.5V IOL = 2.1 mA, Vcc = 2.5V D6 ILI Input leakage current 1 AVIN = VSS or VCC, WP = VSS VIN = VSS or VCC, WP = VCC D7 ILO Output leakage current 1 AVOUT = VSS or VCC D8 CIN, Pin capacitance 10 pFVCC = 5.0V (Note 1) COUT (all inputs/outputs) TA = 25C, FCLK = 1 MHz D9 ICC write Operating current 0.1 3 mAVCC = 5.5V, SCL = 400 kHz D10 ICC read 0.05 400 A D11 ICCS Standby current 0.01 1 A Industrial 5 A Automotive SDA = SCL = VCC = 5.5V A0, A1, A2, WP = VSS Note 1: This parameter is periodically sampled and not 100% tested. 2: Typical measurements taken at room temperature. DS21713H-page 2 2007 Microchip Technology Inc.

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
AT9
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi

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