X-On Electronics has gained recognition as a prominent supplier of APT50DF170HJ Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. APT50DF170HJ Discrete Semiconductor Modules are a product manufactured by Microchip. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

APT50DF170HJ Microchip

APT50DF170HJ electronic component of Microchip
Images are for reference only
See Product Specifications
Part No. APT50DF170HJ
Manufacturer: Microchip
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules Power Module - Diode
Datasheet: APT50DF170HJ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 36.018 ea
Line Total: USD 36.02 
Availability - 6
Ship by Tue. 13 May to Thu. 15 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
6
Ship by Tue. 13 May to Thu. 15 May
MOQ : 1
Multiples : 1
1 : USD 36.018

   
Manufacturer
Product Category
Technology
Case
Mechanical Mounting
Version
Electrical Mounting
Kind Of Package
Leads
Type Of Semiconductor Component
Max. Forward Voltage
Max. Off-State Voltage
Load Current
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the APT50DF170HJ from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the APT50DF170HJ and other electronic components in the Discrete Semiconductor Modules category and beyond.

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APT50DF170HJ ISOTOP Fast Diode V = 1700V RRM I = 50A Tc = 80C Full Bridge Power Module F Application Switch mode power supplies rectifier Induction heating Welding equipment High speed rectifiers Features Ultra fast recovery times Soft recovery characteristics High blocking voltage High current Low leakage current Very low stray inductance High level of integration ISOTOP Package (SOT-227) + ~ Benefits Outstanding performance at high frequency operation ~ - Low losses Low noise switching Direct mounting to heatsink (isolated package) Low junction to case thermal resistance RoHS Compliant Absolute maximum ratings Symbol Parameter Max ratings Unit V Maximum DC reverse Voltage R 1700 V V Maximum Peak Repetitive Reverse Voltage RRM Maximum Average Forward I Duty cycle = 50% T = 80C 50 F(AV) C Current A Maximum repetitive forward current limited I 8.3ms T = 45C 100 FRM J by T Jmax These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com 1-4 www.microsemi.com APT50DF170HJ Rev 1 October 2012 APT50DF170HJ All ratings T = 25C unless otherwise specified j Electrical Characteristics Symbol Characteristic Test Conditions Min Typ Max Unit T = 25C 1.8 2.2 j V Diode Forward Voltage I = 50A V F F T = 125C 1.9 j T = 25C 250 j I Maximum Reverse Leakage Current V = 1700V A RM R T = 125C 500 j Dynamic Characteristics Symbol Characteristic Test Conditions Min Typ Max Unit T = 25C 385 j t Reverse Recovery Time ns rr T = 125C 420 j I = 50A F T = 25C 14 j V = 900V Q Reverse Recovery Charge R C rr T = 125C 23 j di/dt = 800A/s T = 25C 6 j E Reverse Recovery Energy mJ rr T = 125C 12 j Thermal and package characteristics Symbol Characteristic Min Typ Max Unit R Junction to Case Thermal resistance 0.7 thJC C/W R Junction to Ambient 20 thJA RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz V 2500 V ISOL T ,T Storage Temperature Range -55 150 J STG C T Max Lead Temp for Soldering:0.063 from case for 10 sec 300 L Torque Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine) 1.5 N.m g Wt Package Weight 29.2 SOT-227 (ISOTOP ) Package Outline 11.8 (.463) 12.2 (.480) 31.5 (1.240) 31.7 (1.248) 8.9 (.350) 9.6 (.378) W=4.1 (.161) 7.8 (.307) W=4.3 (.169) 8.2 (.322) Hex Nut M4 H=4.8 (.187) (4 places) H=4.9 (.193) (4 places) 25.2 (0.992) 25.4 (1.000) r = 4.0 (.157) 4.0 (.157) 0.75 (.030) 3.30 (.130) 12.6 (.496) (2 places) 4.2 (.165) 0.85 (.033) 4.57 (.180) 12.8 (.504) (2 places) 3.3 (.129) 1.95 (.077) 3.6 (.143) 2.14 (.084) 14.9 (.587) 15.1 (.594) 30.1 (1.185) Dimensions in Millimeters and (Inches) 30.3 (1.193) 38.0 (1.496) 38.2 (1.504) 2-4 www.microsemi.com APT50DF170HJ Rev 1 October 2012

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
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