Product Information

ATSAMA5D27C-D1G-CU

ATSAMA5D27C-D1G-CU electronic component of Microchip

Datasheet
Microprocessors - MPU BGA GREEN, IND TEMP MRLC,1GBit DDR2

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 21.2875 ea
Line Total: USD 21.2875

561 - Global Stock
Ships to you between
Thu. 12 Oct to Mon. 16 Oct
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1172 - Global Stock


Ships to you between Fri. 06 Oct to Thu. 12 Oct

MOQ : 1
Multiples : 1
1 : USD 29.2
10 : USD 23.575
25 : USD 23.2125
50 : USD 22.15
119 : USD 20.875
357 : USD 20.3
595 : USD 19.7375

115 - Global Stock


Ships to you between Fri. 06 Oct to Thu. 12 Oct

MOQ : 1
Multiples : 1
1 : USD 19.2202
25 : USD 19.2202
119 : USD 19.2202

561 - Global Stock


Ships to you between Thu. 12 Oct to Mon. 16 Oct

MOQ : 1
Multiples : 1
1 : USD 21.2875
25 : USD 19.056
119 : USD 18.504

     
Manufacturer
Microchip
Product Category
Microprocessors - MPU
RoHS - XON
Y Icon ROHS
Series
Sama5d2
Core
Arm Cortex A5
Data Bus Width
32 bit
Maximum Clock Frequency
500 MHz
Interface Type
2 - Wire, Ethernet, Can, I2c, Spi, Uart, Usb
Operating Supply Voltage
1.2 V
Number of Cores
1 Core
Mounting Style
Smd/Smt
Package / Case
LFBGA - 289
L1 Cache Instruction Memory
32 Kb
L1 Cache Data Memory
32 Kb
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 125 C
Packaging
Tray
Memory Type
L1/L2 Cache, Rom, Sram
Brand
Microchip
Data Ram Size
128 kb
Data Rom Size
160 kb
Number Of I/Os
128 I/O
I/O Voltage
1.65 v to 3.6 V
Instruction Type
Floating Point
L2 Cache Instruction / Data Memory
128 Kb
Number Of Timers/Counters
6x32 bit
Processor Series
Sama5d2
Factory Pack Quantity :
119
Watchdog Timers
watchdog Timer
Cnhts
8542319000
Hts Code
8542310001
Mxhts
85423102
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SAMA5D2 SIP SAMA5D2 System in Package (SIP) MPU with up to 1 Gbit DDR2 SDRAM or 2 Gbit LPDDR2 SDRAM Scope This document is an overview of the main features of the SAMA5D2 SIP. The sole reference documents for product information on the SAMA5D2 and the LPDDR2/DDR2-SDRAM memories are listed in the table below. Introduction The SAMA5D2 System-In-Package (SIP) integrates the Arm Cortex -A5 processor-based SAMA5D2 MPU with up to 1 Gbit DDR2-SDRAM or up to 2 Gbit LPDDR2-SDRAM in a single package. By combining the high-performance, ultra-low power SAMA5D2 with LPDDR2/DDR2-SDRAM in a single package, PCB routing complexity, area and number of layers is reduced in the majority of cases. This makes board design easier and more robust by facilitating design for EMI, ESD and signal integrity. DDR2-SDRAM memory sizes and package options available 128 Mbit, TFBGA196 512 Mbit and 1 Gbit, TFBGA289 LPDDR2-SDRAM memory sizes and package options available 1 Gbit and 2 Gbit, TFBGA361 While the smallest option targets applications with a small OS or bare metal, the larger options are suitable for applications using Linux . Reference Documents Type Document Title Available Ref. No. Data sheet SAMA5D2 Series www.microchip.com DS60001476 2 Mwords 4 Banks 16 bits Data sheet www.winbond.com W9712G6KB25I DDR2 SDRAM (128 Mbit) 8 Mwords 4 Banks 16 bits Data sheet www.winbond.com W9751G6KB25I DDR2 SDRAM (512 Mbit) 8 Mwords 8 Banks 16 bits Data sheet www.winbond.com W971GG6SB25I DDR2 SDRAM (1 Gbit) 4 Mwords 8 Banks 32 bits Data sheet www.apmemory.com AD210032F-I-AB LPDDR2-SDRAM (1 Gbit) 8 Mwords 8 Banks 32 bits Data sheet www.apmemory.com AD220032D-I-ED/PC/AB LPDDR2-SDRAM (2 Gbit) Datasheet DS60001484D-page 1 2021 Microchip Technology Inc. SAMA5D2 SIP Table of Contents Scope............................................................................................................................................................. 1 Introduction.....................................................................................................................................................1 Reference Documents....................................................................................................................................1 1. Features..................................................................................................................................................4 2. DDR2-SDRAM Features......................................................................................................................... 7 3. LPDDR2-SDRAM Features.....................................................................................................................8 4. Configuration Summary.......................................................................................................................... 9 5. Chip Identifier........................................................................................................................................10 6. Package and Ballout..............................................................................................................................11 7. Memory................................................................................................................................................. 39 8. Electrical Characteristics.......................................................................................................................40 8.1. Recommended Thermal Operating Conditions..........................................................................40 8.2. Decoupling................................................................................................................................. 40 8.3. Power Sequences...................................................................................................................... 40 9. Mechanical Characteristics................................................................................................................... 45 9.1. 361-ball TFBGA..........................................................................................................................45 9.2. 289-ball TFBGA..........................................................................................................................48 9.3. 196-ball TFBGA..........................................................................................................................49 10. Ordering Information............................................................................................................................. 50 11. Revision History.................................................................................................................................... 51 11.1. DS60001484D - 03/2021............................................................................................................51 11.2. DS60001484C - 01/2020............................................................................................................51 11.3. DS60001484B - 11/2018............................................................................................................51 11.4. DS60001484A - 09/2017............................................................................................................51 The Microchip Website.................................................................................................................................52 Product Change Notification Service............................................................................................................52 Customer Support........................................................................................................................................ 52 Product Identification System.......................................................................................................................53 Microchip Devices Code Protection Feature................................................................................................53 Legal Notice................................................................................................................................................. 54 Trademarks.................................................................................................................................................. 54 Quality Management System....................................................................................................................... 55 DS60001484D-page 2 Datasheet 2021 Microchip Technology Inc.

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

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