MMA053AA Microchip

Name: MMA053AA
Brand: Microchip
SKU: MMA053AA_Microchip
Availability: OutOfStock
Rating: 5 (11 reviews)

MMA053AA electronic component of Microchip

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X-On Electronics has gained recognition as a prominent supplier of MMA053AA RF Amplifier across the USA, India, Europe, Australia, and various other global locations. MMA053AA RF Amplifier are a product manufactured by Microchip. We provide cost-effective solutions for RF Amplifier, ensuring timely deliveries around the world.

Part No.	MMA053AA
Manufacturer:	Microchip
Category:	RF Amplifier
Description:	RF Amplifier MMIC, DC-6GHz, 1.0W Output Power Amplifier
Datasheet:	MMA053AA Datasheet (PDF)

Price (USD)

50: USD 210.2378 ea
Line Total: USD 10511.89

Availability : 0

Qty	Unit Price
50	$ 210.2378

MMA053AA More Buying Options & Price Grid(s)

Availability

Price (USD)

Quantity

Availability 0

Ship by Thu. 07 Aug to Mon. 11 Aug

MOQ : 50
Multiples : 50

Qty	Unit Price
50	$ 210.2378

We are delighted to provide the MMA053AA from our RF Amplifier category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MMA053AA and other electronic components in the RF Amplifier category and beyond.

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Additional Infomation About Product

MMA053AA Datasheet DC8 GHz 1 W GaAs MMIC pHEMT Distributed Power Amplifier Released May 2017DC8 GHz 1 W GaAs MMIC pHEMT Distributed Power Amplifier Contents 1 Revision History ............................................................................................................................. 1 1.1 Revision 1.0 ........................................................................................................................................ 1 2 Product Overview .......................................................................................................................... 2 2.1 Applications ........................................................................................................................................ 2 2.2 Key Features ....................................................................................................................................... 2 3 Electrical Specifications .................................................................................................................. 3 3.1 Absolute Maximum Ratings ................................................................................................................ 3 3.2 Specified Electrical Performance ........................................................................................................ 3 3.3 Typical Performance Curves ............................................................................................................... 3 4 Chip Outline Specification .............................................................................................................. 7 4.1 Chip Outline Drawing ......................................................................................................................... 7 4.2 Die Packaging Information ................................................................................................................. 7 4.3 Bond Pad Information ........................................................................................................................ 8 4.4 Assembly Diagram .............................................................................................................................. 9 4.5 Applications Information .................................................................................................................. 10 5 Handling and Die Attachment Recommendations ...................................................................... 11 6 Ordering Information ................................................................................................................... 12 Microsemi Proprietary and Confidential. Document Number: MSCC-0341-DS-00107-1.00-0517 Revision: 1.0

HS Compliance

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:

AT9 may also be referenced as

ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi

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Manufacturer Microchip Microchip
Product Category RF Amplifier RF Amplifier
RoHS - XON Y Y
Mounting Style Smd/Smt Smd/Smt
Package / Case DIE DIE
Type Distributed Distributed
Technology Gaas Gaas
Operating Frequency dc to 8 GHz dc to 8 GHz
P1dB - Compression Point 29 Dbm 29 Dbm
Gain 17 Db 17 Db
Operating Supply Voltage 11 V 11 V
NF - Noise Figure 3 Db 3 Db
OIP3 - Third Order Intercept 43 Dbm 43 Dbm
Minimum Operating Temperature - 55 C - 55 C
Maximum Operating Temperature + 85 C + 85 C
Pd - Power Dissipation 5.6 W 5.6 W
Operating Supply Current 410 mA 410 mA
Test Frequency dc to 8 GHz dc to 8 GHz
Brand Microchip Microchip
Number Of Channels 1 Channel 1 Channel
Input Return Loss - 17 Db - 17 Db
Product Type Rf Amplifier Rf Amplifier
Factory Pack Quantity : 25 25
Subcategory Wireless & Rf Integrated Circuits Wireless & Rf Integrated Circuits