Product Information

MSMBJ170Ae3

MSMBJ170Ae3 electronic component of Microchip

Datasheet
ESD Suppressors / TVS Diodes Uni-Directional TVS
Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

900: USD 0.9146 ea
Line Total: USD 823.14

0 - Global Stock
MOQ: 900  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1


Ships to you between Wed. 22 May to Tue. 28 May

MOQ : 900
Multiples : 1

Stock Image

MSMBJ170Ae3
Microchip

900 : USD 0.9146
9000 : USD 0.8748
90000 : USD 0.8573

0 - WHS 2


Ships to you between Tue. 28 May to Thu. 30 May

MOQ : 900
Multiples : 900

Stock Image

MSMBJ170Ae3
Microchip

900 : USD 1.1907

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product Type
Vesd - Voltage ESD Contact
Vesd - Voltage ESD Air Gap
Termination Style
Package / Case
Packaging
Brand
Factory Pack Quantity :
Subcategory
Cnhts
Hts Code
Mxhts
Taric
LoadingGif

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Additional Infomation About Product

MSMBG5.0A MXLSMBG170CAe3, MSMBJ5.0A MXLSMBJ170CAe3 Screening in 600 Watt Surface Mount reference to Available MIL-PRF-19500 Transient Voltage Suppressor available DESCRIPTION The MSMB 5.0A MSMB 170CA series of surface mount 600 watt transient voltage suppressors provide a selection of standoff voltages (Vwm) from 5.0 to 170 V. These high-reliability devices are available in either unidirectional or bidirectional versions. The SMBG Gull-wing design in the DO- 215AA package is ideal for visible solder connections. The SMBJ J-bend design in the DO- 214AA package allows for greater PC board mounting density. It is available with SnPb or RoHS compliant matte-tin plating. DO-215AA Important: For the latest information, visit our website MSMBG5.0A MXLSMBG170CAe3, MSMBJ5.0A MXLSMBJ170CAe3 MECHANICAL and PACKAGING CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 requirements. TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL- STD-750, method 2026. MARKING: Part number. POLARITY: Cathode end banded. TAPE & REEL option: Standard per EIA-481-1-A (add TR suffix to part number). Consult factory for quantities. WEIGHT: Approximately 0.1 grams. See Package Dimensions on last page. PART NOMENCLATURE M SM B G 5.0 C A e3 Reliability Level* RoHS Compliance M e3 = RoHS Compliant MA Blank = non-RoHS Compliant MX MXL +/- 5% Tolerance Level *(see High Reliability Up- Screened Plastic Products Polarity Portfolio) C = bidirectional Blank = unidirectional Surface Mount Package Stand-Off Voltage (V ) WM 600 W Power Level (see Electrical Characteristics table) Lead Form G = Gull-Wing J = J-Bend SYMBOLS & DEFINITIONS Symbol Definition Working Peak (Standoff) Voltage - The maximum peak voltage that can be applied over the operating temperature V WM range. This is also referred to as standoff voltage. P Peak Pulse Power - Rated random recurring peak impulse power dissipation. PP V Breakdown Voltage - The minimum voltage the device will exhibit at a specified current. ( BR) I Standby Current - The current at the rated standoff voltage (V ). D WM I PP Peak Pulse Current - The peak current during the impulse. Clamping Voltage - Clamping voltage at I (peak pulse current) at the specified pulse conditions (typically shown as PP V C maximum value). I Breakdown Current The current used for measuring breakdown voltage V . BR ( BR) RF01000, Rev. C (1/4/13) 2013 Microsemi Corporation Page 2 of 7

HS Compliance

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS

Microchip may also be referenced as

AT9
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
MICREL SEMICONDUCTOR
MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
MICROCHIP (MICROSEMI)
MICROCHIP (SUPERTEX)
Microchip / Microsemi
Microchip / Vectron
Microchip Tech
MICROCHIP TECH.
Microchip Technology
Microchip Technology Micrel
Microchip Technology / Atmel
Microchip Technology / Micrel
MICROCHIPDIRECT
MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
MICROSEMI COMMUNICATIONS INC.
Microsemi Consumer Medical Product Group
Microsemi Corporation
Microsemi FTD
Microsemi Power Management Group
Microsemi Power Products Group
Microsemi SoC
MICROSEMI/LAWRENCE
MICROSEMI/LINFINITY
MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi

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