Product Information

SST12LF03-Q3DE

SST12LF03-Q3DE electronic component of Microchip

Datasheet
RF Front End WLAN 11B/G/N FEM PA+LNA+SPDT

Manufacturer: Microchip
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1

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SST12LF03-Q3DE
Microchip

1 : USD 1.4464
25 : USD 1.212
100 : USD 1.0478
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1

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SST12LF03-Q3DE
Microchip

1 : USD 2.5567
N/A

Obsolete
0 - WHS 3


Multiples : 1

Stock Image

SST12LF03-Q3DE
Microchip

N/A

Obsolete
0 - WHS 4


Multiples : 3000

Stock Image

SST12LF03-Q3DE
Microchip

N/A

Obsolete
     
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Product Category
RoHS - XON
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2.4GHzHigh-Gain,High-EfficiencyFront-endModule SST12LF03 A Microchip Technology Company Product Brief SST12LF03 is a fully integrated Front-End Module (FEM) for WLAN 802.11b/g/n and Blue- tooth systems. SST12LF03 RF module includes a PA, a LNA, and an antenna switch, making it ideal for WLAN/BT embedded applications where small size and high perfor- mance are required. Based on GaAs PHEMT/HBT technology, SST12LF03 operates within the frequency range of 2.4- 2.5 GHz with a very low DC-current consumption. The Transmitter chain has excellent linearity, typically 3% added EVM up to 19 dBm output power for 54 Mbps 802.11g operation, while meeting 802.11b spectrum mask at 22 dBm. The receiver chain provides a low noise amplifier and has options for simultaneous WLAN and Bluetooth operation.The SST12LF03 is offered in a 20-contact UQFN package. Bluetooth Path: Features Typically 2.5 dB loss Input/output ports are matched to 50 internally and DC decoupled. Simultaneous BT/WLAN Rx mode: 8 dB gain Packages available 3.1 dB noise figure 20-contact UQFN 3mm x 3mm x 0.55mm All non-Pb (lead-free) devices are RoHS compliant Applications WLAN (IEEE 802.11b/g/n) Transmitter Chain: Home RF High gain: Typically 28 dB gain across 2.42.5 GHz over tempera- Cordless phones ture -20C to +85C for Transmitter. 2.4 GHz ISM wireless equipment High linear output power (at 3.3V): Meets 802.11g OFDM ACPR requirement up to 21 dBm Zigbee 3% added EVM up to 19 dBm for 54 Mbps 802.11g signal Meets 802.11b ACPR requirement up to 22 dBm Bluetooth High power-added efficiency/Low operating cur- rent for 802.11b/g/n applications ~25% P = 22 dBm for 802.11b/g Block Diagram OUT Low shut-down current (~2 A) V PA V DET EN CC Limited variation over temperature ~1 dB power variation between -20C to +85C ~2 dB gain variation between -20C to +85C CRX TX IN Temperature and load insensitive on-chip power detector >20 dB dynamic range, temperature-stable, on-chip power detection CTX WLAN RX Antenna OUT Receiver Chain: LNA ON: BT Typically 12 dB gain 3.1 dB noise figure >5dB P1dB CBT CBTR V DD 12LF03-BlockDiagram 2012 Silicon Storage Technology, Inc. www.microchip.com DS75028A 01/122.4GHzHigh-Gain,High-EfficiencyFront-endModule SST12LF03 A Microchip Technology Company Product Brief Product Ordering Valid combinations for SST12LF03 SST12LF03-Q3DE SST12LF03 Evaluation Kits SST12LF03-Q3DE-K Note: Valid combinations are those products in mass production or will be in mass production. Consult your SST sales representative to confirm availability of valid combinations and to determine availability of new combinations. Contact Information Thank you for your interest in Microchip RF products. The data sheet for this device contains proprie- tary information. To obtain a copy of the data sheet, contact your local Microchip sales representative or distributor at the link below. Global Sales and Distribution Table 1:Revision History Revision Description Date A Jan 2012 Initial release of Product Brief ISBN:978-1-61341-997-7 2012 Silicon Storage Technology, Inca Microchip Technology Company. All rights reserved. SST, Silicon Storage Technology, the SST logo, SuperFlash, MTP, and FlashFlex are registered trademarks of Silicon Storage Tech- nology, Inc. MPF, SQI, Serial Quad I/O, and Z-Scale are trademarks of Silicon Storage Technology, Inc. All other trademarks and registered trademarks mentioned herein are the property of their respective owners. Specifications are subject to change without notice. Refer to www.microchip.com for the most recent documentation. For the most current package drawings, please see the Packaging Specification located at

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
AT9
ATM
Atmel
Atmel Wireless (VA)
M4S
M6S
M8S
M9S
MCP
Micrel
Micrel Inc
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MICREL SYNERGY SEMI
MICROCHIP (ATMEL)
MICROCHIP (MICREL)
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Microchip Technology / Atmel
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MICROSEMI
Microsemi Analog Mixed Signal Group
Microsemi Analog Mixed Signal Group [MIL]
Microsemi Commercial Components Group
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Microsemi Consumer Medical Product Group
Microsemi Corporation
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Microsemi Power Management Group
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Microsemi SoC
MICROSEMI/LAWRENCE
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MSC
Roving Networks
ROVING NETWORKS INC
ROVING NETWORKS INC.
ROVING NETWORKS, INC.
Silicon Storage
SILICON STORAGE TECH
SILICON STORAGE TECHNOLOGY
Supertex
Vectron
VECTRON INTERNATIONAL
VECTRON INTL
Vitesse Microsemi
Vitesse / Microsemi

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