Product Information

MT25QL02GCBB8E12-0AAT

MT25QL02GCBB8E12-0AAT electronic component of Micron

Datasheet
512MX4 NOR FLASH PLASTIC PBF TBGA SPI

Manufacturer: Micron
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 43.6398 ea
Line Total: USD 43.64

2580 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
101 - WHS 1


Ships to you between Fri. 24 May to Thu. 30 May

MOQ : 1
Multiples : 1
1 : USD 50.206

2580 - WHS 2


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1
1 : USD 43.6398
10 : USD 40.4718
25 : USD 39.4751
50 : USD 38.4903
100 : USD 34.3019
250 : USD 33.7087
1122 : USD 31.6323
2244 : USD 31.6086

     
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RoHS - XON
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2Gb, 3V Multiple I/O Serial Flash Memory Features Micron Serial NOR Flash Memory 3V, Multiple I/O, 4KB, 32KB, 64KB Sector Erase MT25QL02GCBB Options Marking Features Voltage Stacked device (four 512Mb die) 2.73.6V L SPI-compatible serial bus interface Density Single and double transfer rate (STR/DTR) 2Gb 02G Clock frequency Device stacking 133 MHz (MAX) for all protocols in STR 4 die stacked C 90 MHz (MAX) for all protocols in DTR Device generation B Dual/quad I/O commands for increased through- Die revision B put up to 90 MB/s Pin configuration Supported protocols in both STR and DTR RESET and HOLD 8 Extended I/O protocol Sector Size Dual I/O protocol 64KB E Quad I/O protocol Packages JEDEC-standard, RoHS- Execute-in-place (XIP) compliant PROGRAM/ERASE SUSPEND operations 24-ball T-PBGA 05/6mm x 8mm 12 Volatile and nonvolatile configuration settings (TBGA24) Software reset Standard security 0 Additional reset pin for selected part numbers Special options 3-byte and 4-byte address modes: enable memory Standard S access beyond 128Mb Automotive A Dedicated 64-byte OTP area outside main memory Operating temperature range Readable and user-lockable From 40C to +85C IT Permanent lock with PROGRAM OTP command From 40C to +105C AT Erase capability From 40C to +125C UT Die erase Sector erase 64KB uniform granularity Subsector erase 4KB, 32KB granularity Security and write protection Volatile and nonvolatile locking and software write protection for each 64KB sector Nonvolatile configuration locking Password protection Hardware write protection: nonvolatile bits (BP 3:0 and TB) define protected area size Program/erase protection during power-up CRC detects accidental changes to raw data Electronic signature JEDEC-standard 3-byte signature (BA22h) Extended device ID: two additional bytes identify device factory options JESD47H-compliant Minimum 100,000 ERASE cycles per sector Data retention: 20 years (TYP) 09005aef8661dcd4 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 mt25q-qlkt-L02-CBB-S-IT.pdf - Rev. G 05/19 EN 2015 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.2Gb, 3V Multiple I/O Serial Flash Memory Features Part Number Ordering Micron Serial NOR Flash devices are available in different configurations and densities. Verify valid part numbers by using Microns part catalog search at www.micron.com. To compare features and specifications by device type, visit www.micron.com/products. Contact the factory for devices not found. Figure 1: Part Number Ordering Information MT 25Q L xxx A BA 1 E SF - 0 S IT ES Micron Technology Production Status Blank = Production Part Family ES = Engineering samples 25Q = SPI NOR QS = Qualification samples Voltage Operating Temperature L = 2.73.6V IT = 40C to +85C U = 1.72.0V AT = 40C to +105C UT = 40C to +125C Density 064 = 64Mb (8MB) Special Options 128 = 128Mb (16MB) S = Standard 256 = 256Mb (32MB) A = Automotive grade AEC-Q100 512 = 512Mb (64MB) 01G = 1Gb (128MB) Security Features 02G = 2Gb (256MB) 0 = Standard default security Stack Package Codes A = 1 die/1 S 12 = 24-ball T-PBGA, 05/6 x 8mm (5 x 5 array) B = 2 die/1 S 14 = 24-ball T-PBGA, 05/6 x 8mm (4 x 6 array) C = 4 die/1 S SC = 8-pin SOP2, 150 mils SE = 8-pin SOP2, 208 mils Device Generation SF = 16-pin SOP2, 300 mils B = 2nd generation W7 = 8-pin W-PDFN, 6 x 5mm W9 = 8-pin W-PDFN, 8 x 6mm 1 Die Revision 5x = WLCSP package A = Rev. A B = Rev. B Sector size E = 64KB sectors, 4KB and 32KB subsectors Pin Configuration Option 1 = HOLD pin 3 = RESET pin 8 = RESET and HOLD pin Note: 1. WLCSP package codes, package size, and availability are density-specific. Contact the factory for availability. 09005aef8661dcd4 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 mt25q-qlkt-L02-CBB-S-IT.pdf - Rev. G 05/19 EN 2015 Micron Technology, Inc. All rights reserved.

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
EL9
Elpida Memory
ELPIDA MEMORY INC
IE6
MI9
MICRON SEMICONDUCTOR
Micron Tech
MICRON TECHNOLOGY
Micron Technology Inc
Micron Technology Inc.
NU9
Numonyx - A DIVISION OF MICRON SEMICONDUCTOR PRODUCTS, INC. (VA)

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