Product Information

MT48LC4M32B2P-6A

MT48LC4M32B2P-6A electronic component of Micron

Datasheet
SDRAM, 128MBIT, 166MHZ, 86TSOP

Manufacturer: Micron
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 10.584 ea
Line Total: USD 10.58

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 1
Multiples : 1
1 : USD 10.584
10 : USD 9.351
25 : USD 9.1525
50 : USD 9.1128
100 : USD 8.1841
250 : USD 7.9301

     
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Access Time
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Memory Type
Dram Memory Configuration
Page Size
No Of Pins
Memory Case Style
Operating Temperature Min
Operating Temperature Max
Ic Interface Type
Msl
Svhc
Operating Temperature Range
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128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 1 Meg x 32 x 4 Banks Options Marking Features Configuration PC100-compliant 4 Meg x 32 (1 Meg x 32 x 4 banks) 4M32B2 Fully synchronous all signals registered on positive 1 Package OCPL edge of system clock 86-pin TSOP II (400 mil) TG Internal pipelined operation column address can 86-pin TSOP II (400 mil) Pb-free P be changed every clock cycle 90-ball VFBGA (8mm x 13mm) F5 Internal banks for hiding row access/precharge 90-ball VFBGA (8mm x 13mm) Pb- B5 Programmable burst lengths: 1, 2, 4, 8, or full page free Auto precharge, includes concurrent auto precharge Timing (cycle time) and auto refresh modes 3 6ns (166 MHz) -6A Self refresh mode (not available on AT devices) 2 6ns (166 MHz) -6 Auto refresh 2 7ns (143 MHz) -7 64ms, 4096-cycle refresh (commercial and Revision :G/:L industrial) Operating temperature range 16ms, 4096-cycle refresh (automotive) Commercial (0C to +70C) None LVTTL-compatible inputs and outputs Industrial (40C to +85C) IT Single 3.3V 0.3V power supply 4 Automotive (40C to +105C) AT Supports CAS latency (CL) of 1, 2, and 3 1. Off-center parting line. Notes: 2. Available only on Revision G. 3. Available only on Revision L. 4. Contact Micron for availability. Table 1: Key Timing Parameters CL = CAS (READ) latency Clock t t t t Speed Grade Frequency (MHz) Target RCD- RP-CL RCD (ns) RP (ns) CL (ns) -6 167 3-3-3 18 18 18 -6A 167 3-3-3 18 18 18 -7 143 3-3-3 15 15 15 PDF: 09005aef80872800 Micron Technology, Inc. reserves the right to change products or specifications without notice. 1 128mb x32 sdram.pdf - Rev. R 10/12 EN 2001 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice.128Mb: x32 SDRAM Features Table 2: Address Table Parameter 4 Meg x 32 Configuration 1 Meg x 32 x 4 banks Refresh count 4K Row addressing 4K A 11:0 Bank addressing 4 BA 1:0 Column addressing 256 A 7:0 Table 3: 128Mb (x32) SDR Part Numbering Part Numbers Architecture MT48LC4M32B2TG 4 Meg x 32 MT48LC4M32B2P 4 Meg x 32 1 MT48LC4M32B2F5 4 Meg x 32 1 MT48LC4M32B2B5 4 Meg x 32 Note: 1. FBGA Device Decoder: www.micron.com/decoder. PDF: 09005aef80872800 Micron Technology, Inc. reserves the right to change products or specifications without notice. 2 128mb x32 sdram.pdf - Rev. R 10/12 EN 2001 Micron Technology, Inc. All rights reserved.

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
EL9
Elpida Memory
ELPIDA MEMORY INC
IE6
MI9
MICRON SEMICONDUCTOR
Micron Tech
MICRON TECHNOLOGY
Micron Technology Inc
Micron Technology Inc.
NU9
Numonyx - A DIVISION OF MICRON SEMICONDUCTOR PRODUCTS, INC. (VA)

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