Reference Only Spec No. JENF243J-0002B-01 P1/8 CHIP NOISE FILTER NFZ2MSMSN10L REFERENCE SPECIFICATION 1. Scope This reference specification applies to NFZ2MSM SN10L, Chip Noise Filter 2. Part Numbering (ex) NF Z 2M S M 181 S N 1 0 L Product ID Structure Dimension Characteristics Typical Impedance Performance Category Numbers special Packaging (LW) at 100MHz of speci- L:Taping Circuit fication *B: BULK *B: Bulk packing also available 3. Rating Operating Temperature Range 40C to + 85C Storage Temperature Range 40C to + 85C DC Resistance Impedance at 100MH (m) Rated Current *1 Customer MURATA (A) Part Number Part Number () Tolerance Typ. Max. NFZ2MSM101SN10L 100 14 18 4.0 NFZ2MSM181SN10L 180 20 25 3.4 25% NFZ2MSM301SN10L 300 24 30 3.1 NFZ2MSM601SN10L 600 37 46 2.5 *1: When applied Rated current to the Products, self temperature rise shall be limited to 40 max. Typical value is actual performance. 4. Testing Conditions Unless otherwise specified In case of doubt Temperature : Ordinary Temperature / 15C to 35C Temperature : 20C 2C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106kPa 5. Appearance and Dimensions 0.5 0.2 Unit Mass (Typical value) 0.012g 0.9 0.1 2.0 0.2 1.6 0.2 (in mm) MURATA MFG.CO., LTD Reference Only Spec No. JENF243J-0002B-01 P2/8 6. Electrical Performance No. Item Specification Test Method 6.1 Impedance Impedance shall meet item 3. Measuring Equipment: KEYSIGHT 4991A or equivalent (1mA) Measuring Frequency: 100MHz 6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter Digital multi meter (TR6846 or equivalent) a terminal1 terminal2 SW b DC resistance shall be measured after putting chip noise filter between the terminal 2 under the condition of opening between a and b. Every measurement the terminal 1 shall be shorted between a and b when changing noise filter. 7. Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip noise filter shall not be damaged Applied Direction Chip Noise Filter after tested as follows. Chip Coil F Substrate Force: 10N Hold Duration: 5s1s Applied Direction: Parallel to PCB Substrate: Glass-epoxy substrate 7.2 Bending Test (100mm40mm1.0mm) Solder: Reflow Pressure jig F R230 Deflection (in mm) Product 45 45 Speed of Applying Force: 0.5mm / s Deflection: 2mm Hold Duration: 30 s 7.3 Vibration Oscillation Frequency: 10Hz to 2000Hz to 10Hz for 20 min Total amplitude 3.0 mm or Acceleration 2 amplitude 245m/s whichever is smaller. Testing Time: A period of 4h in each of 3 mutually perpendicular directions. 7.4 Drop It shall be dropped on concrete or steel board. Method : free fall Height : 1m Total of 10 cycles MURATA MFG.CO., LTD