Product Information

74HCU04D

74HCU04D electronic component of Nexperia

Datasheet
IC, 74HC CMOS, SMD, 74HCU04, SOIC14

Manufacturer: Nexperia
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5: USD 0.5123 ea
Line Total: USD 2.56

0 - Global Stock
MOQ: 5  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 5
Multiples : 1

Stock Image

74HCU04D
Nexperia

5 : USD 0.5031
50 : USD 0.3726
100 : USD 0.2599
500 : USD 0.2316
1000 : USD 0.2023

     
Manufacturer
Product Category
Logic Type
Brand
Logic Family / Base Number
Output Current
No. Of Inputs
Supply Voltage Min
Supply Voltage Max
Logic Case Style
No. Of Pins
Logic Ic Family
Logic Ic Base Number
Operating Temperature Min
Operating Temperature Max
Rohs Phthalates Compliant
Msl
Svhc
Base Number
Ic Generic Number
Logic Function Number
Logic Ic Function
No. Of Gates
Operating Temperature Range
Supply Voltage
Supply Voltage Range
Termination Type
LoadingGif

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74HCU04 Hex unbuffered inverter Rev. 7 8 December 2015 Product data sheet 1. General description The 74HCU04 is a hex unbuffered inverter. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of V . CC 2. Features and benefits Complies with JEDEC standard JESD7A Balanced propagation delays ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V Multiple package options Specified from 40 C to +125 C 3. Ordering information Table 1. Ordering information Type number Package Temperature Name Description Version range 74HCU04D 40 C to +125 C SO14 plastic small outline package 14 leads body width 3.9 mm SOT108-1 74HCU04DB 40 C to +125 C SSOP14 plastic shrink small outline package 14 leads body width SOT337-1 5.3 mm 74HCU04PW 40 C to +125 C TSSOP14 plastic thin shrink small outline package 14 leads SOT402-1 body width 4.4 mm 74HCU04BQ 40 C to +125 C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin SOT762-1 quad flat package no leads 14 terminals body 2.5 3 0.85 mm&& < *1 74HCU04 NXP Semiconductors Hex unbuffered inverter 4. Functional diagram < < < < < < < D P Q D P Q D P Q Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram (one inverter) 5. Pinning information WHUPDO LQ 9 QGH DUHDL 9 9 < DO D WYR H U 7 (1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to V . CC Fig 4. Pin configuration SO14 and (T)SSOP14 Fig 5. Pin configuration DHVQFN14 74HCU04 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 7 8 December 2015 2 of 17 DQVSDUQW LHZS *1 D DO < < < < && < < < < && < < +&8 +&8

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