BAS116H,115 Nexperia

BAS116H Low leakage switching diode Rev. 3 31 May 2011 Product data sheet 1. Product profile 1.1 General description Low leakage switching diode, encapsulated in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Small and flat lead SMD plastic package Low leakage current Excellent coplanarity and improved thermal behavior AEC-Q101 qualified 1.3 Applications General-purpose switching 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit 1 2 I forward current -- 215 mA F I reverse current V = 75 V - 0.003 5.0 nA R R V reverse voltage - - 75 V R 3 t reverse recovery time -0.8 3.0 s rr 1 Pulse test: t 300 s 0.02. p 2 Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 3 When switched from I = 10 mA to I =10mA R = 100 measured at I =1mA. F R L R 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 1 cathode 12 2 anode 1 2 sym001 1 The marking bar indicates the cathode.BAS116H Nexperia Low leakage switching diode 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BAS116H - plastic surface-mounted package 2 leads SOD123F 4. Marking Table 4. Marking codes Type number Marking code BAS116H B1 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V repetitive peak reverse -85 V RRM voltage V reverse voltage - 75 V R 1 2 I forward current -215 mA F I repetitive peak forward -500 mA FRM current 3 I non-repetitive peak forward square wave FSM current t =1 s- 4 A p t =1ms - 1 A p t =1s - 0.5 A p 1 4 P total power dissipation T 25 C -375 mW tot amb 5 T junction temperature - 150 C j T ambient temperature 65 +150 C amb T storage temperature 65 +150 C stg 1 Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 2 Pulse test: t 300 s 0.02. p 3 T =25 C prior to surge. j 4 Reflow soldering is the only recommended soldering method. 5 Soldering point of cathode tab. BAS116H All information provided in this document is subject to legal disclaimers. Nexperia B.V. 2017. All rights reserved Product data sheet Rev. 3 31 May 2011 2 of 10