BAT54VV Nexperia

BAT54VV Schottky barrier triple diode in ultra small SOT666 package Rev. 02 15 January 2010 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier triple diode with an integrated guard ring for stress protection. Three electrically isolated Schottky barrier diodes, encapsulated in a SOT666 ultra small SMD plastic package. 1.2 Features Low forward voltage Ultra small SMD plastic package Low capacitance Flat leads: excellent coplanarity and improved thermal behavior 1.3 Applications Ultra high-speed switching Voltage clamping Line termination Inverse-polarity protection 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V continuous reverse voltage - - 30 V R I continuous forward current - - 200 mA F 2. Pinning information Table 2. Pinning Pin Description Simplified outline Symbol 1 anode (diode 1) 6 5 4 6 5 4 2 anode (diode 2) 3 anode (diode 3) 4 cathode (diode 3) 1 2 3 5 cathode (diode 2) sym046 12 3 6 cathode (diode 1) SOT666NXP Semiconductors BAT54VV Schottky barrier triple diode in ultra small SOT666 package 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BAT54VV - plastic surface mounted package 6 leads SOT666 4. Marking Table 4. Marking codes Type number Marking code BAT54VV C6 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode V continuous reverse voltage - 30 V R I continuous forward current - 200 mA F I repetitive peak forward t 1 s 0.5 - 300 mA FRM p current I non-repetitive peak forward t < 10 ms - 600 mA FSM p current 1 2 P total power dissipation T 25 C -170 mW tot amb T junction temperature - 125 C j T ambient temperature 65 +125 C amb T storage temperature 65 +150 C stg 1 Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. 2 Single diode loaded. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit 1 2 R thermal resistance from in free air -- 590 K/W th(j-a) junction to ambient 1 Refer to SOT666 standard mounting conditions. 2 Reflow soldering is the only recommended soldering method. BAT54VV 2 NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 15 January 2010 2 of 9