028196EB NXP

74HC573 74HCT573 Octal D-type transparent latch 3-state Rev. 6 26 January 2015 Product data sheet 1. General description The 74HC573 74HCT573 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard no. 7A. The 74HC573 74HCT573 has octal D-type transparent latches featuring separate D-type inputs for each latch and 3-state true outputs for bus-oriented applications. A latch enable (LE) input and an output enable (OE) input are common to all latches. When LE is HIGH, data at the Dn inputs enter the latches. In this condition, the latches are transparent, i.e. a latch output changes state each time its corresponding D input changes. When LE is LOW the latches store the information that was present at the D-inputs a set-up time preceding the HIGH-to-LOW transition of LE. When OE is LOW, the contents of the 8 latches are available at the outputs. When OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE input does not affect the state of the latches. The 74HC573 74HCT573 is functionally identical to: 74HC563 74HCT563, but inverted outputs 74HC373 74HCT373, but different pin arrangement 2. Features and benefits Input levels: For 74HC573: CMOS level For 74HCT573: TTL level Inputs and outputs on opposite sides of package allowing easy interface with microprocessors Useful as input or output port for microprocessors and microcomputers 3-state non-inverting outputs for bus-oriented applications Common 3-state output enable input Multiple package options ESD protection: HBM JESD22-A114F exceeds 2 000 V MM JESD22-A115-A exceeds 200 V Specified from 40 Cto+85 C and from 40 Cto+125 C74HC573 74HCT573 NXP Semiconductors Octal D-type transparent latch 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC573N 40 C to +125 C DIP20 plastic dual in-line package 20 leads (300 mil) SOT146-1 74HCT534N 74HC573D 40 C to +125 C SO20 plastic small outline package 20 leads SOT163-1 body width 7.5 mm 74HCT573D 74HC573DB 40 C to +125 C SSOP20 plastic shrink small outline package 20 leads SOT339-1 body width 5.3 mm 74HCT573DB 74HC573PW 40 C to +125 C TSSOP20 plastic thin shrink small outline package 20 leads SOT360-1 body width 4.4 mm 74HCT573PW 74HC573BQ 40 C to +125 C DHVQFN20 plastic dual in-line compatible thermal enhanced very SOT764-1 thin quad flat package no leads 20 terminals 74HCT573BQ body 2.5 4.5 0.85 mm 4. Functional diagram 7 / 7 ( 67 WR 3 6 PQ Fig 1. Functional diagram 74HC HCT573 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 26 January 2015 2 of 21 D 2( /( 4 4 4 4 87287 &+ 4 4 4 4