Product Information

B4860NXN7QUMD

B4860NXN7QUMD electronic component of NXP

Datasheet
Digital Signal Processors & Controllers - DSP, DSC QorIQ Qonverge SoC, 6x1.2GHz Starcore DSP, 4x1.6GHz e6500 CPU, DDR3/3L, -40-105C

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

24: USD 520.8532 ea
Line Total: USD 12500.48

0 - Global Stock
MOQ: 24  Multiples: 24
Pack Size: 24
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 27 May to Wed. 29 May

MOQ : 24
Multiples : 24
24 : USD 661.871
120 : USD 661.871
264 : USD 661.871
504 : USD 661.871
1008 : USD 661.871
2520 : USD 661.871
5016 : USD 661.871
10008 : USD 661.871

     
Manufacturer
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Maximum Clock Frequency
Maximum Operating Temperature
Packaging
Rad Hardened
Device Core Size
Instruction Set Architecture
Operating Temperature Classification
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ACCOUNT ENGLISH CART ALL Search... PRODUCTS APPLICATIONS SUPPORT ABOUT B4860NXN7QUMD :Part Detail Product Summary Page General Information Package Information Environmental and Compliance Information Manufacturing Information Ordering Information Operating Characteristics Reliability Data Lookup General Information Part Number B4860NXN7QUMD Description QorIQ Qonverge SoC, 6x1.2GHz Starcore DSP, 4x1.6GHz e6500 CPU, MAPLE-B3 accelerator, -40-105C Product Line G9164 PTI NLQA Material Type Tested Packaged Device Life Cycle Description (code) PRODUCT STABLE GROWTH/MATURITY Status Active Application/Qualification Tier 10-YEARS APPLICATION LIFE Package Information Package Type and Termination FCPBGA 1020 Count Package Description and FCPBGA 1020 33*33*2 P1 Mechanical Drawing Device Weight(g) 7.09730 Package Length (nominal)(mm) 33.000 Package Width (nominal)(mm) 33.000 Package Thickness (nominal)(mm) 2.000 Tape & Reel No Environmental and Compliance Information Pb-Free RoHS Compliant Halogen Free Yes Material Composition Declaration Download MCD Report Download MCD Report (MCD) RoHS Certificate of Analysis (CoA) Contact Us 2nd Level Interconnect e1 Moisture Sensitivity Level (MSL) 3 Floor Life 168 HOURSPeak Package Body Temperature 250 (PPT)(C) Maximum Time at Peak 30 Temperature (s) Number of Reflow Cycles 3 REACH SVHC NXP REACH Statement Manufacturing Information Micron Size(m) .028 Ordering Information Minimum Package Quantity (MPQ) 24 MPQ Container TRAY Exempt from Minimum Delivery No Value Preferred Order Quantity (POQ) 120 POQ Container BRICK Export Control Classification 3A991A1 Number (US) Harmonized Tariff ( CCATS Document - ENC Status - Other Trade Compliance - Documents Budgetary Price excluding 1000 @ US each tax(US Currency Order Operating Characteristics Accelerators DPAA MAPLE-B AltiVec SIMD unit Additional Features CPRI SRIO Ambient Operating Temperature -40 to 105 (Min-Max) (C) Bus Frequency (Max) (MHz) 600 Cache (KB) 32 Core Type SC3900 e6500 Core: Number of cores (Spec) 10 DUART 2 eSPI 1 External Bus Interface PCI-Express External Memory Supported DDR3

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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