BAT85 NXP

BAT85 Schottky barrier single diode 24 July 2012 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a hermetically-sealed subminiature SOD68 (DO-34) package. The diode is suitable for mounting on a 2 E (5.08 mm) pitch. 1.2 Features and benefits Low forward voltage Guard ring protected Hermetically-sealed leaded glass package 1.3 Applications Ultra high-speed switching Voltage clamping Protection circuits Blocking diodes 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit I average forward 0.5 ; f = 20 kHz; PCB mounting, - - 200 mA F(AV) current lead length = 4 mm; half sine wave V reverse voltage - - 30 V R V forward voltage I = 10 mA; T = 25 C - - 400 mV F F amb 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 K cathode k a K A aaa-003679 2 A anode DO-34 (SOD68) Scan or click this QR code to view the latest information for this productNXP Semiconductors BAT85 Schottky barrier single diode 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BAT85 DO-34 hermetically sealed glass package; axial leaded; 2 leads SOD68 4. Marking Table 4. Marking codes Type number Marking code BAT85 marking band 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V reverse voltage - 30 V R I forward current - 200 mA F I average forward current 0.5 ; f = 20 kHz; PCB mounting, - 200 mA F(AV) lead length = 4 mm; half sine wave I repetitive peak forward current t 1 s; 0.5 - 300 mA FRM p I non-repetitive peak forward t 10 ms; T = 25 C - 5 A FSM p j(init) current T junction temperature - 125 C j T ambient temperature -65 125 C amb T storage temperature -65 150 C stg 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R thermal resistance in free air [1] - - 320 K/W th(j-a) from junction to ambient [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. BAT85 All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved Product data sheet 24 July 2012 2 / 8