BZA100,118 NXP

DISCRETE SEMICONDUCTORS DATA SHEET M3D184 BZA100 18-fold ESD transient voltage suppressor Product data sheet 1997 Dec 02 Supersedes data of 1996 Mar 21 NXP Semiconductors Product data sheet 18-fold ESD transient voltage BZA100 suppressor FEATURES DESCRIPTION PINNING SO20 SMD package allows 18 18-fold monolitic transient voltage PIN DESCRIPTION separate voltage regulator diodes suppressor. Its 18-fold junction 1 to 5 cathode (k to k ) 1 5 in a common anode configuration common anode design protects 18 6 and 16 common anode (a a ) 1 2 separate lines using only one Working voltage: typ. 6.8 V package. This device is ideal for 7 to 15 cathode (k to k ) 6 14 Forward voltage: max. 1.3 V situations where board space is a 17 to 20 cathode (k to k ) 15 18 Maximum reverse peak power premium. dissipation: 27.5 W at t = 1 ms p Maximum clamping voltage at peak pulse current: 11 V at 2.5 A handbook, 4 columns k k 1 20 1 18 Low leakage current: max. 2 A k k 2 19 2 17 ESD rating >8 kV, according k k IEC 801-2. 3 18 3 16 20 19 18 17 16 15 14 13 12 11 k k 4 4 17 15 APPLICATIONS k a 5 5 16 2 SO20 Where transient overvoltage a k 1 6 15 14 protection in voltage and ESD k k 6 7 14 13 sensitive equipment is required 1 2 3 4 5 6 7 8 9 10 such as: k k 8 13 7 12 MBG396 Computers k k 9 12 8 11 Printers k k 10 11 9 10 Business machines Communication systems Fig.1 Pin configuration for SO20 (SOT163-1) and symbol. Medical equipment. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT I working current note 1 mA Z I continuous forward current 200 mA F I non-repetitive peak forward current t = 1 ms square pulse 4 A FSM p I non-repetitive peak reverse current t = 1 ms square pulse see Fig.2 2.5 A ZSM p P total power dissipation see Fig.3 tot up to T = 60 C note 2 1.6 W s up to T = 25 C note 3 1.25 W amb P non-repetitive peak reverse power t = 1 ms square pulse see Fig.4 27.5 W ZSM p dissipation T storage temperature 65 +150 C stg T operating junction temperature 150 C j Notes 1. DC working current limited by P . tot max 2. One or more diodes loaded T is the temperature at the soldering point. s 3. One or more diodes loaded device mounted on a printed-circuit board with R = 43.5 K/W. th a-s 1997 Dec 02 2