MC10XS3435DHFK

NXP Semiconductors Document Number: MC10XS3435 Rev. 12.0, 8/2018 Technical Data Quad high-side switch 10XS3435 (dual 10 mOhm, dual 35 mOhm) The 10XS3435 is one in a family of devices designed for low voltage automotive lighting applications. Its four low R MOSFETs (dual 10 mOhm/dual DS(on) 35 mOhm) can control four separate 55/28 W bulbs, and/or Xenon modules, and/or LEDs. HIGH-SIDE SWITCH Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Its output with selectable slew rate improves electromagnetic compatibility (EMC) behavior. Additionally, each output has its own parallel input or SPI control for pulse-width modulation (PWM) control. The 10XS3435 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush. The device has Fail-safe mode to provide functionality of the outputs in case of MCU damage. This device is powered using SMARTMOS technology. Features Four protected 10 mOhm and 35 mOhm high-side switches (at 25 C) Operating voltage range of 6.0 to 20 V with sleep current < 5.0 A, FK SUFFIX extended mode from 4.0 to 28 V 98ARL10596D 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting with daisy 24-PIN PQFN chain capability PWM module using external clock or calibratable internal oscillator with Applications programmable outputs delay management Low-voltage automotive lighting Smart overcurrent shutdown, severe short-circuit, overtemperature Xenon bulbs protections with time limited autoretry, and Fail-safe mode in case of MCU Halogen bulbs damage Light-emitting diodes (LEDs) Output OFF or ON openload detection compliant to bulbs or LEDs and short to battery detection High beam Analog current feedback with selectable ratio and board temperature Low beam feedback Flashers Low-voltage industrial lighting V V V V V DD DD PWR DD PWR 10XS3435 VDD VPWR HS0 WAKE LOAD I/O FS SCLK SCLK CS CS HS1 SI SO LOAD I/O RST SO SI MCU HS2 I/O IN0 LOAD I/O IN1 I/O IN2 I/O IN3 HS3 A/D CSNS LOAD FSI GND GND Figure 1. 10XS3435 simplified application diagram 2018 NXP B.V.Table of Contents 1 Orderable parts 3 2 Device variations . 3 3 Internal block diagram . 4 4 Pin connections 5 5 Electrical characteristics 7 5.1 Maximum ratings 7 5.2 Static electrical characteristics . 9 5.3 Dynamic electrical characteristics 15 5.4 Timing diagrams . 22 6 Functional description 25 6.1 Introduction . 25 6.2 Functional pin description 25 6.3 Functional internal block description 27 7 Functional device operation 28 7.1 SPI protocol description . 28 7.2 Operational modes . 28 7.3 Protection and diagnostic features . 33 7.4 Logic commands and registers 37 8 Typical applications 47 9 Packaging . 48 9.1 Soldering information . 48 9.2 Package dimensions 48 10 Additional documentation 52 10.1Thermal addendum (Rev 2.0) . 52 11 Revision history . 57 10XS3435 2 NXP Semiconductors