MC56F82348MLH

Document Number MC56F82348MLH NXP Semiconductors Rev. 2, 07/2020 Data Sheet: Technical Data MC56F82348MLH MC56F82348 Supports MC56F82348MLH Features Communication interfaces Up to two high-speed queued SCI (QSCI) modules This family of digital signal controllers (DSCs) is with LIN slave functionality based on the 32-bit 56800EX core. Each device Up to two queued SPI (QSPI) modules combines, on a single chip, the processing power of a One I2C/SMBus port DSP and the functionality of an MCU with a flexible One Modular/Scalable Controller Area Network set of peripherals to support many target applications: (MSCAN) module Industrial control Home appliances Timers Smart sensors One 16-bit quad timer (1 x 4 16-bit timer) Wireless charging Two Periodic Interval Timers (PITs) Power distribution systems Security and integrity Motor control (ACIM, BLDC, PMSM, SR, stepper) Cyclic Redundancy Check (CRC) generator Photovoltaic systems Windowed Computer operating properly (COP) Circuit breaker watchdog Medical device/equipment External Watchdog Monitor (EWM) Instrumentation Clocks DSC based on 32-bit 56800EX core Two on-chip relaxation oscillators: 8 MHz (400 kHz Up to 50 MIPS at 50 MHz core frequency at standby mode) and 200 kHz DSP and MCU functionality in a unified, C-efficient Crystal / resonator oscillator architecture System On-chip memory DMA controller Up to 64 KB flash memory Integrated power-on reset (POR) and low-voltage Up to 8 KB data/program RAM interrupt (LVI) and brown-out reset module On-chip flash memory and RAM can be mapped Inter-module crossbar connection into both program and data memory spaces JTAG/enhanced on-chip emulation (EOnCE) for Analog unobtrusive, real-time debugging Two high-speed, 8-channel, 12-bit ADCs with Operating characteristics dynamic x1, x2, and x4 programmable amplifier Single supply: 3.0 V to 3.6 V Four analog comparators with integrated 6-bit DAC 5 Vtolerant I/O (except for RESETB pin which is a references 3.3 V pin only) Up to two 12-bit digital-to-analog converters (DAC) 64-pin LQFP package One FlexPWM module with up to 8 PWM outputs NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Overview............................................................................................3 7.2 Moisture handling ratings........................................................28 1.1 MC56F82348MLH Product Features......................................3 7.3 ESD handling ratings.............................................................. 28 1.2 56800EX 32-bit Digital Signal Controller (DSC) core...........3 7.4 Voltage and current operating ratings..................................... 29 1.3 Operation Parameters.............................................................. 4 8 General............................................................................................... 30 1.4 On-Chip Memory and Memory Protection............................. 5 8.1 General characteristics............................................................ 30 1.5 Interrupt Controller................................................................. 5 8.2 AC electrical characteristics....................................................31 1.6 Peripheral highlights............................................................... 6 8.3 Nonswitching electrical specifications....................................32 1.7 Block diagrams........................................................................11 8.4 Switching specifications..........................................................38 2 MC56F82348MLH signal and pin descriptions.................................14 8.5 Thermal specifications............................................................ 39 3 Signal groups......................................................................................22 9 Peripheral operating requirements and behaviors..............................40 4 Ordering parts.....................................................................................22 9.1 Core modules...........................................................................40 4.1 Determining valid orderable parts...........................................22 9.2 System modules.......................................................................41 5 Part identification...............................................................................23 9.3 Clock modules.........................................................................42 5.1 Description.............................................................................. 23 9.4 Memories and memory interfaces........................................... 44 5.2 Format..................................................................................... 23 9.5 Analog..................................................................................... 46 5.3 Fields....................................................................................... 23 9.6 Timer....................................................................................... 51 6 Terminology and guidelines...............................................................23 9.7 Communication interfaces.......................................................52 6.1 Definition: Operating requirement.......................................... 23 10 Design Considerations....................................................................... 58 6.2 Definition: Operating behavior............................................... 24 10.1 Thermal design considerations................................................58 6.3 Definition: Attribute................................................................24 10.2 Electrical design considerations.............................................. 60 6.4 Definition: Rating....................................................................25 10.3 Power-on Reset design considerations....................................61 6.5 Result of exceeding a rating.................................................... 25 11 Obtaining package dimensions.......................................................... 63 6.6 Relationship between ratings and operating requirements......25 12 Pinout................................................................................................. 63 6.7 Guidelines for ratings and operating requirements................. 26 12.1 Signal Multiplexing and Pin Assignments..............................63 6.8 Definition: Typical value........................................................ 26 12.2 Pinout diagrams.......................................................................65 6.9 Typical value conditions......................................................... 27 13 Product documentation.......................................................................66 7 Ratings................................................................................................28 14 Revision History.................................................................................67 7.1 Thermal handling ratings........................................................ 28 MC56F82348, Rev. 2, 07/2020 2 NXP Semiconductors