MC56F82726VLFR

Document Number MC56F823XX NXP Semiconductors Rev. 4, 05/2020 Data Sheet: Technical Data MC56F823XX MC56F823xx Supports MC56F82323VFM, MC56F82316VLF, MC56F82313VLC Features Communication interfaces Up to two high-speed queued SCI (QSCI) modules This family of digital signal controllers (DSCs) is with LIN slave functionality based on the 32-bit 56800EX core. On a single chip, One queued SPI (QSPI) module each device combines the processing power of a DSP One I2C/SMBus port and the functionality of an MCU, with a flexible set of peripherals to support many target applications: Timers Industrial control One 16-bit quad timer (1 x 4 16-bit timer) Home appliances Two Periodic Interval Timers (PITs) Smart sensors Security and integrity Wireless charging Cyclic Redundancy Check (CRC) generator Power distribution systems Windowed Computer operating properly (COP) Motor control (ACIM, BLDC, PMSM, SR, stepper) watchdog Photovoltaic systems External Watchdog Monitor (EWM) Circuit breaker Medical device/equipment Clocks Instrumentation Two on-chip relaxation oscillators: 8 MHz (400 kHz at standby mode) and 200 kHz DSC based on 32-bit 56800EX core Crystal / resonator oscillator Up to 50 MIPS at 50 MHz core frequency DSP and MCU functionality in a unified, C-efficient System architecture DMA controller Integrated power-on reset (POR) and low-voltage On-chip memory interrupt (LVI) and brown-out reset module Up to 32 KB flash memory Inter-module crossbar connection Up to 6 KB data/program RAM JTAG/enhanced on-chip emulation (EOnCE) for On-chip flash memory and RAM can be mapped unobtrusive, real-time debugging into both program and data memory spaces Operating characteristics Analog Single supply: 3.0 V to 3.6 V Two high-speed, 5-channel, 12-bit ADCs with 5 Vtolerant I/O (except for RESETB pin which is a dynamic x1, x2, and x4 programmable amplifier 3.3 V pin only) Three analog comparators with integrated 6-bit DAC Operation ambient temperature: -40C to 105C references Up to two 12-bit digital-to-analog converters (DAC) 48-pin LQFP, 32-pin LQFP and 32-pin QFN packages One FlexPWM module with up to 6 PWM outputs NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Overview............................................................................................3 6.1 Thermal handling ratings........................................................ 27 1.1 MC56F823xx Product Family.................................................3 6.2 Moisture handling ratings........................................................27 1.2 56800EX 32-bit Digital Signal Controller (DSC) core...........3 6.3 ESD handling ratings.............................................................. 27 1.3 Operation Parameters.............................................................. 4 6.4 Voltage and current operating ratings..................................... 28 1.4 On-Chip Memory and Memory Protection............................. 5 7 General............................................................................................... 29 1.5 Interrupt Controller................................................................. 5 7.1 General characteristics............................................................ 29 1.6 Peripheral highlights............................................................... 6 7.2 AC electrical characteristics....................................................30 1.7 Block diagrams........................................................................11 7.3 Nonswitching electrical specifications....................................31 2 MC56F823xx signal and pin descriptions..........................................14 7.4 Switching specifications..........................................................37 2.1 Signal groups...........................................................................20 7.5 Thermal specifications............................................................ 38 3 Ordering parts.....................................................................................21 8 Peripheral operating requirements and behaviors..............................39 3.1 Determining valid orderable parts...........................................21 8.1 Core modules...........................................................................39 4 Part identification...............................................................................21 8.2 System modules.......................................................................40 4.1 Description.............................................................................. 21 8.3 Clock modules.........................................................................41 4.2 Format..................................................................................... 21 8.4 Memories and memory interfaces........................................... 43 4.3 Fields....................................................................................... 22 8.5 Analog..................................................................................... 45 4.4 Example...................................................................................22 8.6 Timer....................................................................................... 51 5 Terminology and guidelines...............................................................22 8.7 Communication interfaces.......................................................52 5.1 Definition: Operating requirement.......................................... 22 9 Design Considerations....................................................................... 57 5.2 Definition: Operating behavior............................................... 23 9.1 Thermal design considerations................................................57 5.3 Definition: Attribute................................................................23 9.2 Electrical design considerations.............................................. 59 5.4 Definition: Rating....................................................................23 9.3 Power-on Reset design considerations....................................60 5.5 Result of exceeding a rating.................................................... 24 10 Obtaining package dimensions.......................................................... 62 5.6 Relationship between ratings and operating requirements......24 11 Pinout................................................................................................. 63 5.7 Guidelines for ratings and operating requirements................. 25 11.1 Signal Multiplexing and Pin Assignments..............................63 5.8 Definition: Typical value........................................................ 25 11.2 Pinout diagrams.......................................................................64 5.9 Typical value conditions......................................................... 26 12 Product documentation.......................................................................66 6 Ratings................................................................................................27 13 Revision History.................................................................................67 MC56F823xx, Rev. 4, 05/2020 2 NXP Semiconductors