Product Information

MCIMX351AJQ5C

MCIMX351AJQ5C electronic component of NXP

Datasheet
SOC i.MX35 ARM1136JF-S 0.09um Automotive 400-Pin MAP-BGA Tray

Manufacturer: NXP
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Price (USD)

1: USD 47.759 ea
Line Total: USD 47.76

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1
1 : USD 47.759
5 : USD 41.441
10 : USD 36.8833
25 : USD 32.8766
50 : USD 30.2884

0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 15
Multiples : 15
15 : USD 29.6193

0 - Global Stock


Ships to you between Thu. 09 May to Mon. 13 May

MOQ : 1
Multiples : 1
1 : USD 26.2752
10 : USD 22.7855
450 : USD 22.7735

     
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RoHS - XON
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Core
Data Bus Width
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Number of Cores
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L1 Cache Instruction Memory
L1 Cache Data Memory
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Maximum Operating Temperature
Packaging
Application
Height
Length
Memory Type
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Data Rom Size
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Cnhts
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Mxhts
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Freescale Semiconductor Document Number: MCIMX35SR2AEC Rev. 10, 06/2012 Data Sheet: Technical Data IMX35 Package Information Plastic Package Case 5284 17 x 17 mm, 0.8 mm Pitch i.MX35 Applications Processors for Ordering Information Automotive Products See Table 1 on page 3 for ordering information. 1. Introduction 1 1 Introduction 1.1. Features 2 1.2 Ordering Information 3 The i.MX35 Auto Application Processor family is 1.3. Block Diagram . 5 2 Functional Description and Application Information 4 designed for automotive infotainment and navigation 2.1. Application Processor Domain Overview . 5 applications. These processors are AECQ100 Grade 3 2.2. Shared Domain Overview 6 2.3. Advanced Power Management Overview 6 qualified and rated for ambient operating temperatures 2.4. ARM11 Microprocessor Core 6 up to 85 C. 2.5. Module Inventory . 7 3. Signal Descriptions: Special Function Related Pins 12 Based on an ARM11 microprocessor core running at up 4. Electrical Characteristics . 13 to 532 MHz, the device offers the following features and 4.1. i.MX35 Chip-Level Conditions 13 4.2. Power Modes . 15 optimized system cost for the target applications. 4.3. Supply Power-Up/Power-Down Requirements and Restrictions 16 Audio connectivity and telematics: 4.4. Reset Timing . 18 Compressed audio playback from storage 4.5. Power Characteristics 19 4.6. Thermal Characteristics . 20 devices (CD, USB, HDD or SD card) 4.7. I/O Pin DC Electrical Characteristics . 21 PlayFromDevice (1-wire and 2-wire 4.8. I/O Pin AC Electrical Characteristics . 24 4.9. Module-Level AC Electrical Specifications . 30 support) for portable media players 5. Package Information and Pinout 131 iPod/iPhone control and playback 5.1. MAPBGA Production Package 1568-01, 17 17 mm, 0.8 Pitch 132 High-speed CD ripping to USB, SD/MMC 5.2. MAPBGA Signal Assignments . 133 6. Product Documentation . 145 or HDD for virtual CD changer 7. Revision History . 146 Audio processing for hands-free telephony: Bluetooth, AEC/NS, and microphone beam forming Speech recognition Freescale Semiconductor, Inc., 2010. All rights reserved. A/V connectivity and navigation: Includes audio connectivity and telematics features Map display and route calculation QVGA video decode, WVGA video display Sophisticated graphical user interface The i.MX35 processor takes advantage of the ARM1136JF-S core running at 532 MHz that is boosted by a multilevel cache system, and features peripheral devices such as an autonomous image processing unit, a vector floating point (VFP11) co-processor, and a RISC-based DMA controller. The i.MX35 supports connections to various types of external memories, such as SDRAM, mobile DDR and DDR2, SLC and MLC NAND Flash, NOR Flash and SRAM. The device can be connected to a variety of external devices such as high-speed USB2.0 OTG, ATA, MMC/SDIO, and Compact Flash. 1.1 Features The i.MX35 is designed for automotive infotainment video-enabled applications. It provides low-power solutions for applications demanding high-performance multimedia and graphics. The i.MX35 is based on the ARM1136 platform, which has the following features: ARM1136JF-S processor, version r1p3 16-Kbyte L1 instruction cache 16-Kbyte L1 data cache 128-Kbyte L2 cache, version r0p4 128 Kbytes of internal SRAM Vector floating point unit (VFP11) To boost multimedia performance, the following hardware accelerators are integrated: Image processing unit (IPU) OpenVG 1.1 graphics processing unit (GPU) (not available for the MCIMX351) The MCIMX35 provides the following interfaces to external devices (some of these interfaces are muxed and not available simultaneously): 2 controller area network (CAN) interfaces 2 SDIO/MMC interfaces, 1 SDIO/CE-ATA interface (CE-ATA is not available for the MCIMX351) 32-bit mobile DDR, DDR2 (4-bank architecture), and SDRAM (up to 133 MHz) 2 configurable serial peripheral interfaces (CSPI) (up to 52 Mbps each) Enhanced serial audio interface (ESAI) 2 synchronous serial interfaces (SSI) Ethernet MAC 10/100 Mbps 1 USB 2.0 host with ULPI interface or internal full-speed PHY. Up to 480 Mbps if external HS PHY is used. 1 USB 2.0 OTG (up to 480 Mbps) controller with internal high-speed OTG PHY i.MX35 Applications Processors for Automotive Products, Rev. 10 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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