Document Number: K10P32M50SF0 Freescale Semiconductor Rev. 4 5/2012 Data Sheet: Technical Data K10P32M50SF0 K10 Sub-Family Supports the following: MK10DN32VFM5, MK10DX32VFM5, MK10DN64VFM5, MK10DX64VFM5, MK10DN128VFM5, MK10DX128VFM5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V 128-bit unique identification (ID) number per chip Temperature range (ambient): -40 to 105C Analog modules Performance 16-bit SAR ADC Up to 50 MHz ARM Cortex-M4 core with DSP Two analog comparators (CMP) containing a 6-bit instructions delivering 1.25 Dhrystone MIPS per DAC and programmable reference input MHz Timers Memories and memory interfaces Programmable delay block Up to 128 KB program flash. Eight-channel motor control/general purpose/PWM Up to 32 KB FlexNVM on FlexMemory devices timer 2 KB FlexRAM on FlexMemory devices Two-channel quadrature decoder/general purpose Up to 16 KB RAM timer Serial programming interface (EzPort) Periodic interrupt timers 16-bit low-power timer Clocks Carrier modulator transmitter 3 to 32 MHz crystal oscillator Real-time clock 32 kHz crystal oscillator Multi-purpose clock generator Communication interfaces SPI module System peripherals I2C module Multiple low-power modes to provide power Three UART modules optimization based on application requirements I2S module 4-channel DMA controller, supporting up to 41 request sources External watchdog monitor Software watchdog Low-leakage wakeup unit Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20112012 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.3.2 General switching specifications...........................20 1.1 Determining valid orderable parts......................................3 5.4 Thermal specifications.......................................................21 2 Part identification......................................................................3 5.4.1 Thermal operating requirements...........................21 2.1 Description.........................................................................3 5.4.2 Thermal attributes.................................................21 2.2 Format...............................................................................3 6 Peripheral operating requirements and behaviors....................22 2.3 Fields.................................................................................3 6.1 Core modules....................................................................22 2.4 Example............................................................................4 6.1.1 JTAG electricals....................................................22 3 Terminology and guidelines......................................................4 6.2 System modules................................................................25 3.1 Definition: Operating requirement......................................4 6.3 Clock modules...................................................................25 3.2 Definition: Operating behavior...........................................5 6.3.1 MCG specifications...............................................25 3.3 Definition: Attribute............................................................5 6.3.2 Oscillator electrical specifications.........................27 3.4 Definition: Rating...............................................................6 6.3.3 32 kHz Oscillator Electrical Characteristics...........29 3.5 Result of exceeding a rating..............................................6 6.4 Memories and memory interfaces.....................................30 3.6 Relationship between ratings and operating 6.4.1 Flash electrical specifications................................30 requirements......................................................................6 6.4.2 EzPort Switching Specifications............................34 3.7 Guidelines for ratings and operating requirements............7 6.5 Security and integrity modules..........................................35 3.8 Definition: Typical value.....................................................7 6.6 Analog...............................................................................35 3.9 Typical value conditions....................................................8 6.6.1 ADC electrical specifications.................................35 4 Ratings......................................................................................9 6.6.2 CMP and 6-bit DAC electrical specifications.........40 4.1 Thermal handling ratings...................................................9 6.7 Timers................................................................................43 4.2 Moisture handling ratings..................................................9 6.8 Communication interfaces.................................................43 4.3 ESD handling ratings.........................................................9 6.8.1 DSPI switching specifications (limited voltage 4.4 Voltage and current operating ratings...............................9 range)....................................................................43 5 General.....................................................................................10 6.8.2 DSPI switching specifications (full voltage range).45 5.1 AC electrical characteristics..............................................10 6.8.3 I2C switching specifications..................................47 5.2 Nonswitching electrical specifications...............................10 6.8.4 UART switching specifications..............................47 5.2.1 Voltage and current operating requirements.........10 6.8.5 I2S/SAI Switching Specifications..........................47 5.2.2 LVD and POR operating requirements.................11 6.9 Human-machine interfaces (HMI)......................................51 5.2.3 Voltage and current operating behaviors..............12 6.9.1 TSI electrical specifications...................................51 5.2.4 Power mode transition operating behaviors..........13 7 Dimensions...............................................................................53 5.2.5 Power consumption operating behaviors..............14 7.1 Obtaining package dimensions.........................................53 5.2.6 EMC radiated emissions operating behaviors.......18 8 Pinout........................................................................................53 5.2.7 Designing with radiated emissions in mind...........19 8.1 K10 Signal Multiplexing and Pin Assignments..................53 5.2.8 Capacitance attributes..........................................19 8.2 K10 Pinouts.......................................................................54 5.3 Switching specifications.....................................................19 9 Revision History........................................................................55 5.3.1 Device clock specifications...................................19 K10 Sub-Family Data Sheet, Rev. 4 5/2012. 2 Freescale Semiconductor, Inc.