Document Number: K52P144M100SF2V2 Freescale Semiconductor Rev. 3, 6/2013 Data Sheet: Technical Data K52P144M100SF2V2 K52 Sub-Family Supports the following: MK52DN512CLQ10, MK52DN512CMD10 Features Human-machine interface Operating Characteristics Low-power hardware touch sensor interface (TSI) Voltage range: 1.71 to 3.6 V General-purpose input/output Flash write voltage range: 1.71 to 3.6 V Analog modules Temperature range (ambient): -40 to 85C Two 16-bit SAR ADCs Performance Programmable gain amplifier (PGA) (up to x64) Up to 100 MHz ARM Cortex-M4 core with DSP integrated into each ADC instructions delivering 1.25 Dhrystone MIPS per Two 12-bit DACs MHz Two operational amplifiers Two transimpedance amplifiers Memories and memory interfaces Three analog comparators (CMP) containing a 6-bit Up to 512 KB program flash memory on non- DAC and programmable reference input FlexMemory devices Voltage reference Up to 128 KB RAM Serial programming interface (EzPort) Timers FlexBus external bus interface Programmable delay block Eight-channel motor control/general purpose/PWM Clocks timer 3 to 32 MHz crystal oscillator Two 2-channel quadrature decoder/general purpose 32 kHz crystal oscillator timers Multi-purpose clock generator IEEE 1588 timers Periodic interrupt timers System peripherals 16-bit low-power timer Multiple low-power modes to provide power Carrier modulator transmitter optimization based on application requirements Real-time clock Memory protection unit with multi-master protection Communication interfaces 16-channel DMA controller, supporting up to 63 Ethernet controller with MII and RMII interface to request sources external PHY and hardware IEEE 1588 capability External watchdog monitor USB full-/low-speed On-the-Go controller with on- Software watchdog chip transceiver Low-leakage wakeup unit Three SPI modules Two I2C modules Security and integrity modules Six UART modules Hardware CRC module to support fast cyclic Secure Digital host controller (SDHC) redundancy checks I2S module Hardware random-number generator Hardware encryption supporting DES, 3DES, AES, MD5, SHA-1, and SHA-256 algorithms 128-bit unique identification (ID) number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................4 6 Peripheral operating requirements and behaviors....................23 1.1 Determining valid orderable parts......................................4 6.1 Core modules....................................................................23 2 Part identification......................................................................4 6.1.1 Debug trace timing specifications.......................23 2.1 Description.........................................................................4 6.1.2 JTAG electricals..................................................24 2.2 Format...............................................................................4 6.2 System modules................................................................27 2.3 Fields.................................................................................4 6.3 Clock modules...................................................................27 2.4 Example............................................................................5 6.3.1 MCG specifications.............................................27 3 Terminology and guidelines......................................................5 6.3.2 Oscillator electrical specifications.......................29 3.1 Definition: Operating requirement......................................5 6.3.3 32 kHz oscillator electrical characteristics..........32 3.2 Definition: Operating behavior...........................................6 6.4 Memories and memory interfaces.....................................32 3.3 Definition: Attribute............................................................6 6.4.1 Flash electrical specifications.............................32 3.4 Definition: Rating...............................................................7 6.4.2 EzPort switching specifications...........................34 3.5 Result of exceeding a rating..............................................7 6.4.3 Flexbus switching specifications.........................35 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................38 requirements......................................................................7 6.6 Analog...............................................................................38 3.7 Guidelines for ratings and operating requirements............8 6.6.1 ADC electrical specifications..............................38 3.8 Definition: Typical value.....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications......46 3.9 Typical value conditions....................................................9 6.6.3 12-bit DAC electrical characteristics...................49 4 Ratings......................................................................................10 6.6.4 Op-amp electrical specifications.........................52 4.1 Thermal handling ratings...................................................10 6.6.5 Transimpedance amplifier electrical 4.2 Moisture handling ratings..................................................10 specifications full range..................................53 4.3 ESD handling ratings.........................................................10 6.6.6 Transimpedance amplifier electrical 4.4 Voltage and current operating ratings...............................10 specifications limited range............................54 5 General.....................................................................................11 6.6.7 Voltage reference electrical specifications..........55 5.1 AC electrical characteristics..............................................11 6.7 Timers................................................................................56 5.2 Nonswitching electrical specifications...............................11 6.8 Communication interfaces.................................................56 5.2.1 Voltage and current operating requirements......12 6.8.1 Ethernet switching specifications........................56 5.2.2 LVD and POR operating requirements...............13 6.8.2 USB electrical specifications...............................58 5.2.3 Voltage and current operating behaviors............13 6.8.3 USB DCD electrical specifications......................58 5.2.4 Power mode transition operating behaviors.......15 6.8.4 USB VREG electrical specifications...................59 5.2.5 Power consumption operating behaviors............16 6.8.5 DSPI switching specifications (limited voltage 5.2.6 EMC radiated emissions operating behaviors....19 range).................................................................59 5.2.7 Designing with radiated emissions in mind.........20 6.8.6 DSPI switching specifications (full voltage 5.2.8 Capacitance attributes........................................20 range).................................................................61 5.3 Switching specifications.....................................................20 6.8.7 Inter-Integrated Circuit Interface (I2C) timing.....63 5.3.1 Device clock specifications.................................20 6.8.8 UART switching specifications............................64 5.3.2 General switching specifications.........................21 6.8.9 SDHC specifications...........................................64 5.4 Thermal specifications.......................................................22 6.8.10 I2S/SAI switching specifications.........................65 5.4.1 Thermal operating requirements.........................22 6.9 Human-machine interfaces (HMI)......................................71 5.4.2 Thermal attributes...............................................22 6.9.1 TSI electrical specifications................................71 K52 Sub-Family Data Sheet, Rev. 3, 6/2013. 2 Freescale Semiconductor, Inc.