Product Information

MPC8572ELPXAVNE

MPC8572ELPXAVNE electronic component of NXP

Datasheet
MPU PowerQUICC III MPC85xx Processor RISC 32bit 0.09um 1.5GHz 1.8V/2.5V/3.3V 1023-Pin FCBGA Tray

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

24: USD 506.2047 ea
Line Total: USD 12148.91

0 - Global Stock
MOQ: 24  Multiples: 24
Pack Size: 24
     
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Freescale Semiconductor Document Number: MPC8572EEC Technical Data Rev. 6, 06/2014 MPC8572E PowerQUICC III Integrated Processor Hardware Specifications Contents 1 Overview 1. Overview . 1 2. Electrical Characteristics . 10 This section provides a high-level overview of the features 3. Power Characteristics 15 of the MPC8572E processor. Figure 1 shows the major 4. Input Clocks . 16 5. RESET Initialization . 18 functional units within the MPC8572E. 6. DDR2 and DDR3 SDRAM Controller . 19 7. DUART . 27 8. Ethernet: Enhanced Three-Speed Ethernet (eTSEC) 28 1.1 Key Features 9. Ethernet Management Interface Electrical Characteristics 50 The following list provides an overview of the MPC8572E 10. Local Bus Controller (eLBC) 53 feature set: 11. Programmable Interrupt Controller . 65 Two high-performance, 32-bit, Book E-enhanced 12. JTAG . 65 2 13. I C . 67 cores that implement the Power Architecture 14. GPIO . 69 technology: 15. High-Speed Serial Interfaces (HSSI) 71 16. PCI Express 81 Each core is identical to the core within the 17. Serial RapidIO . 89 MPC8572E processor. 18. Package Description . 99 32-Kbyte L1 instruction cache and 32-Kbyte L1 19. Clocking . 117 20. Thermal 121 data cache with parity protection. Caches can be 21. System Design Information 123 locked entirely or on a per-line basis, with 22. Ordering Information . 134 separate locking for instructions and data. 23. Document Revision History 136 Signal-processing engine (SPE) APU (auxiliary processing unit). Provides an extensive instruction set for vector (64-bit) integer and fractional operations. These instructions use both Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 2008-2011, 2014 Freescale Semiconductor, Inc. All rights reserved.Overview the upper and lower words of the 64-bit GPRs as they are defined by the SPE APU. Embedded vector and scalar single-precision floating-point APUs. Provide an instruction set for single-precision (32-bit) floating-point instructions. Double-precision floating-point APU. Provides an instruction set for double-precision (64-bit) floating-point instructions that use the 64-bit GPRs. 36-bit real addressing Memory management unit (MMU). Especially designed for embedded applications. Supports 4-Kbyte to 4-Gbyte page sizes. Enhanced hardware and software debug support Performance monitor facility that is similar to, but separate from, the MPC8572E performance monitor The e500 defines features that are not implemented on this device. It also generally defines some features that this device implements more specifically. An understanding of these differences can be critical to ensure proper operation. 1 Mbyte L2 cache/SRAM Shared by both cores. Flexible configuration and individually configurable per core. Full ECC support on 64-bit boundary in both cache and SRAM modes Cache mode supports instruction caching, data caching, or both. External masters can force data to be allocated into the cache through programmed memory ranges or special transaction types (stashing). 1, 2, or 4 ways can be configured for stashing only. Eight-way set-associative cache organization (32-byte cache lines) Supports locking entire cache or selected lines. Individual line locks are set and cleared through Book E instructions or by externally mastered transactions. Global locking and Flash clearing done through writes to L2 configuration registers Instruction and data locks can be Flash cleared separately. Per-way allocation of cache region to a given processor. SRAM features include the following: 1, 2, 4, or 8 ways can be configured as SRAM. I/O devices access SRAM regions by marking transactions as snoopable (global). Regions can reside at any aligned location in the memory map. Byte-accessible ECC is protected using read-modify-write transaction accesses for smaller-than-cache-line accesses. e500 coherency module (ECM) manages core and intrasystem transactions Address translation and mapping unit (ATMU) Twelve local access windows define mapping within local 36-bit address space. Inbound and outbound ATMUs map to larger external address spaces. Three inbound windows plus a configuration window on PCI Express MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6 2 Freescale Semiconductor

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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