NTS0102GT NXP

NTS0102GT electronic component of NXP
NTS0102GT NXP
NTS0102GT Translation - Voltage Levels
NTS0102GT  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of NTS0102GT Translation - Voltage Levels across the USA, India, Europe, Australia, and various other global locations. NTS0102GT Translation - Voltage Levels are a product manufactured by NXP. We provide cost-effective solutions for Translation - Voltage Levels, ensuring timely deliveries around the world.

Part No. NTS0102GT
Manufacturer: NXP
Category: Translation - Voltage Levels
Description: IC, TRANSLATING TXRX, DUAL, XSON8
Datasheet: NTS0102GT Datasheet (PDF)
Price (USD)
1: USD 0.7537 ea
Line Total: USD 0.75 
Availability : 0
  
QtyUnit Price
1$ 0.7537
10$ 0.4575
100$ 0.3698
500$ 0.3534
1000$ 0.3388
2500$ 0.3117

Availability 0
Ship by Mon. 11 Aug to Fri. 15 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 0.7537
10$ 0.4575
100$ 0.3698
500$ 0.3534
1000$ 0.3388
2500$ 0.3117

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the NTS0102GT from our Translation - Voltage Levels category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NTS0102GT and other electronic components in the Translation - Voltage Levels category and beyond.

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AN10343 MicroPak soldering information Rev. 2 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land patterns for mounting MicroPak packagesAN10343 NXP Semiconductors MicroPak soldering information Revision history Rev Date Description v.2 20101230 text and graphics updated to latest standards Contact information For more information, please visit:

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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